Beckermus Technologies was founded in 1998 by the Beckermus brothers: Oded and Oren.
The founders’ vision was to create an Excellence Center in the field of "Bare Die" assembly services.
The company has evolved alongside growth of the local startup community and expansion of global corporate activity in Israel. Our versatile client base (from R&D/NPI to High Volume production) has optimally qualified us for a worldwide expansion.
Beckermus services are currently available globally, consistently featuring our 3 main fundamental values: high quality, quick response and reasonable pricing.
Prototyping and low-medium volume production is performed at our 750 sqm cleanroom facility. Mass production is performed at our partners’ facilities in the far-east and in Europe receiving our full support and professional liability.
Our main services:
Wire bonding, Encapsulation, Active Alignment, IC packaging, 3D stacked dies, Electro optics and photonics assembly, Die attach, Wafer dicing/sorting, Chip on board/Chip on flex, Flip Chip, Wafer level packaging,
SiP and MCM.
Our quality standards certifications:
- ISO 13485: Medical devices
- IPC-A-610
- AS9100D aerospace
- MILL-STD 883
- QMS certified
Company Details
- Employees
- 9
- Founded
- -
- Address
- 29 Eshel, Caesarea,israel
- Industry
- Appliances, Electrical, And Electronics Manufacturing
- NAICS
-
Electrical Equipment, Appliance, and Component ManufacturingOther Electrical Equipment and Component ManufacturingBattery ManufacturingCommunication and Energy Wire and Cable ManufacturingWiring Device ManufacturingAll Other Electrical Equipment and Component ManufacturingStorage Battery ManufacturingPrimary Battery ManufacturingFiber Optic Cable ManufacturingOther Communication and Energy Wire ManufacturingCurrent-Carrying Wiring Device ManufacturingNoncurrent-Carrying Wiring Device ManufacturingCarbon and Graphite Product ManufacturingAll Other Miscellaneous Electrical Equipment and Component Manufacturing
- Website
- beckermus.com
- Keywords
- Microelectronics, Microelectromechanical systems (MEMS) assembling, Micro-optics, MEMS, Active Alignment, Photonics assembly, micro assembly, bare die assembly, stacked dies assembly, Flip Chip, Wirebonding, wire bonding, IC Packaging, Chip on flex, Chip on board, Wafer level packaging, SIP, MCM, Diode assembly, Prism assembly, lenses assembly, Encapsulation, Die attach.
- HQ
- Caesarea
Beckermus Technologies Questions
Beckermus Technologies's website is beckermus.com
Beckermus Technologies's LinkedIn profile is https://il.linkedin.com/company/beckermus-technologies
Beckermus Technologies has
9 employees.
View email and phone details for 9
employees at Beckermus Technologies.
Beckermus Technologies's industry is
Appliances, Electrical, and Electronics Manufacturing
Beckermus Technologies's top competitors are
Toptica Photonics,
Converge Bio,
Iai - Israel Aerospace Industries,
Fize Medical,
Harmonic,
Arineta,
Israel Innovation Authority רשות החדשנות,
D[Or]²,
Rafael Advanced Defense Systems,
Mrcoral.
Beckermus Technologies's categories are Appliances, Electrical, and Electronics Manufacturing
Beckermus Technologies's founding year is 1998
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