Boschman Advanced Packaging Technology
Semiconductor Manufacturing
Duiven, Gelderland, Nl
85 employees
- Employees
- 85
- Contacts
- 2
- Emails
- 2
- Phones
- 1
Boschman Advanced Packaging Technology Overview
- Headquarters
- Duiven, Gelderland, Nl
- Phone Number
- Available in AeroLeads
- Website
- boschman.nl
- Industry
- Semiconductor Manufacturing
- Employees
- 85
- Founded
- 1987
- Company Email
- Available in AeroLeads
- NAICS
-
Semiconductor and Other Electronic Component Manufacturing
About Boschman Advanced Packaging Technology
Boschman Advanced Packaging Technology, a solution driven company serving the semiconductor assembly industries worldwide Boschman Advanced Packaging Technology is an experienced and dynamic high-tech company serving the global semiconductor assembly industry providing quality solutions for specific market segments, Mems & Sensors, Smartcards and Powers. Boschman Advanced Packaging Technology is founded in 1990 and the head quarter is based in The Netherlands in a modern, well-equipped facility. Molding and Sinter Systems Our molding and Ag-Sinter systems are developed at our systems R&D facility in the Netherlands. Mechanical, electrical, software, process and mold/tool-design experts work in multi-disciplinary teams to realize the best possible total system solution. Our researcher's and designer's long-term technical and field experience is further enhanced by direct end-user interaction. Systems are produced, assembled and tested at our facility in Singapore. Opened in 1997, this production site has gradually developed local capabilities for the manufacturing of our molding and sinter systems. Aside from an experienced production staff, we have local mechanical, electrical, software and process engineers available to ensure and maintain the highest possible production quality. Materials and parts used in our molding systems are carefully selected and tested on the basis of functionality, safety, availability and especially sustainability.
Boschman Advanced Packaging Technology Contact Details
- People in AeroLeads
- 4
- With contact data
- 2
- Email contacts
- 2
- 50.0% coverage
- Phone contacts
- 1
- 25.0% coverage
Boschman Advanced Packaging Technology Org Chart
Sample employees and titles| Name | Title | Location | Contact |
|---|---|---|---|
| Joost De Wolf | Head of Cam and Milling :: Cnc/cam | Doesburg, Gelderland, Netherlands |
Email
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| Emiel De Bruin , PMP | Head of Package Development Engineering |
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| Martijn Lentjes | Mechanical Engineer |
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| Frank Boschman | Managing Director at Boschman | Arnhem-nijmegen Region, Netherlands |
Email
Phone
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Employees by Management Level
Individual contributor
16 profiles
Manager
4 profiles
VP / Head
2 profiles
Director
2 profiles
Senior / Lead
2 profiles
Associate / junior
1 profile
Department Contact Coverage
| Department | Contacts | Phone | |
|---|---|---|---|
| IT | 8 | 8 | 0 |
| General | 5 | 5 | 0 |
| Operations | 1 | 1 | 0 |
| Finance | 1 | 1 | 0 |
Boschman Advanced Packaging Technology Tech Stack
Engineering
7 profiles
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