Boschman Advanced Packaging Technology

Boschman Advanced Packaging Technology

Semiconductor Manufacturing Duiven, Gelderland, Nl 85 employees
Employees
85
Contacts
2
Emails
2
Phones
1

Boschman Advanced Packaging Technology Overview

Headquarters
Duiven, Gelderland, Nl
Phone Number
Available in AeroLeads
Website
boschman.nl
Industry
Semiconductor Manufacturing
Employees
85
Founded
1987
Company Email
Available in AeroLeads
NAICS
Semiconductor and Other Electronic Component Manufacturing

About Boschman Advanced Packaging Technology

Boschman Advanced Packaging Technology, a solution driven company serving the semiconductor assembly industries worldwide Boschman Advanced Packaging Technology is an experienced and dynamic high-tech company serving the global semiconductor assembly industry providing quality solutions for specific market segments, Mems & Sensors, Smartcards and Powers. Boschman Advanced Packaging Technology is founded in 1990 and the head quarter is based in The Netherlands in a modern, well-equipped facility. Molding and Sinter Systems Our molding and Ag-Sinter systems are developed at our systems R&D facility in the Netherlands. Mechanical, electrical, software, process and mold/tool-design experts work in multi-disciplinary teams to realize the best possible total system solution. Our researcher's and designer's long-term technical and field experience is further enhanced by direct end-user interaction. Systems are produced, assembled and tested at our facility in Singapore. Opened in 1997, this production site has gradually developed local capabilities for the manufacturing of our molding and sinter systems. Aside from an experienced production staff, we have local mechanical, electrical, software and process engineers available to ensure and maintain the highest possible production quality. Materials and parts used in our molding systems are carefully selected and tested on the basis of functionality, safety, availability and especially sustainability.

Boschman Advanced Packaging Technology Contact Details

People in AeroLeads
4
With contact data
2
Email contacts
2
50.0% coverage
Phone contacts
1
25.0% coverage

Boschman Advanced Packaging Technology Org Chart

Sample employees and titles
Name Title Contact
Joost De Wolf Head of Cam and Milling :: Cnc/cam
Email
Emiel De Bruin , PMP Head of Package Development Engineering
View
Martijn Lentjes Mechanical Engineer
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Frank Boschman Managing Director at Boschman
Email Phone

Employees by Management Level

Individual contributor 16 profiles
Manager 4 profiles
VP / Head 2 profiles
Director 2 profiles
Senior / Lead 2 profiles
Associate / junior 1 profile

Department Contact Coverage

Department Contacts Email Phone
IT 8 8 0
General 5 5 0
Operations 1 1 0
Finance 1 1 0

Boschman Advanced Packaging Technology Tech Stack

Engineering 7 profiles

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