Boschman Advanced Packaging Technology, a solution driven company serving the semiconductor assembly industries worldwide
Boschman Advanced Packaging Technology is an experienced and dynamic high-tech company serving the global semiconductor assembly industry providing quality solutions for specific market segments, Mems & Sensors, Smartcards and Powers. Boschman Advanced Packaging Technology is founded in 1990 and the head quarter is based in The Netherlands in a modern, well-equipped facility.
Molding and Sinter Systems
Our molding and Ag-Sinter systems are developed at our systems R&D facility in the Netherlands. Mechanical, electrical, software, process and mold/tool-design experts work in multi-disciplinary teams to realize the best possible total system solution. Our researcher's and designer's long-term technical and field experience is further enhanced by direct end-user interaction. Systems are produced, assembled and tested at our facility in Singapore. Opened in 1997, this production site has gradually developed local capabilities for the manufacturing of our molding and sinter systems. Aside from an experienced production staff, we have local mechanical, electrical, software and process engineers available to ensure and maintain the highest possible production quality. Materials and parts used in our molding systems are carefully selected and tested on the basis of functionality, safety, availability and especially sustainability.
Company Details
- Employees
- 85
- Founded
- -
- Address
- Stenograaf 3, Duiven,6921ex,netherlands
- Phone
- +31 263 194 900
- Sa****@****hman.nl
- Industry
- Semiconductor Manufacturing
- NAICS
-
Semiconductor and Other Electronic Component Manufacturing
- Website
- boschman.nl
- HQ
- Duiven
Boschman Advanced Packaging Technology Questions
Boschman Advanced Packaging Technology's helpline number is +31 263 194 900
Boschman Advanced Packaging Technology's website is boschman.nl
Boschman Advanced Packaging Technology's LinkedIn profile is https://nl.linkedin.com/company/boschman-technologies-b-v-
Boschman Advanced Packaging Technology has
85 employees.
View email and phone details for 85
employees at Boschman Advanced Packaging Technology.
Boschman Advanced Packaging Technology's industry is
Semiconductor Manufacturing
Boschman Advanced Packaging Technology's top competitors are
Nxp Semiconductors,
Fastmicro,
Tempress,
Nexperia,
Sempro Technologies Bv,
Axelera Ai,
Schunk Xycarb Technology,
Besi Netherlands B.v.,
Trymax Semiconductor,
Citc - Chip Integration Technology Center.
Boschman Advanced Packaging Technology's support email address is Sales@Boschman.nl
Boschman Advanced Packaging Technology's categories are Semiconductor Manufacturing
Boschman Advanced Packaging Technology's founding year is 1987
