Design And Reuse

Design And Reuse company information, Employees & Contact Information

Updated June 2026

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Design And Reuse is a Semiconductors company and founded in 1997. It has approximately 12 employees on record. Contact data was last refreshed in June 2026. Find Design And Reuse's verified employee emails, phone numbers, headquarters address, and key decision makers below.

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Design & Reuse (D&R) was founded in 1997, the same year it launched its IP web portal, www.design-reuse.com. Today Design-Reuse.com is the industry's premier online IP/SoC marketplace, viewed by 70,000 absolute unique visitors per month (source: Google Analytics). As part of its continuing commitment to support the needs of the electronic design industry, D&R has extended its scope to cover new higher level design approaches with its new site, www.dr-embedded.com. The new site provides a venue for connecting system designers with vendors of subsystems, platforms, and middleware. D&R also continues to maintain its focus on streamlining IP-based design with its Enterprise IP Management System (IPMS) offering, a Java/XML multi-application, configurable enterprise platform offering the most innovative and straightforward solution for internal and external IP management.

Company Details

Employees
12
Founded
1997
Address
Grenoble, Fr
Industry
Semiconductors
Keywords
Virsbo.
HQ
Grenoble
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Design And Reuse Questions

News

The Blind Spot of Semiconductor IP Sales - Design And Reuse

The Blind Spot of Semiconductor IP Sales Design And Reuse

BLACKBOX AI: Dissecting the AI Network Traffic - Design And Reuse

BLACKBOX AI: Dissecting the AI Network Traffic Design And Reuse

Deploying Chiplets into Mass Markets - Design And Reuse

Deploying Chiplets into Mass Markets Design And Reuse

Space Force’s Secret Launch, Pixel 10’s Big Debut & EV Upheaval – Tech Roundup (Aug 21–22, 2025) - ts2.tech

Space Force’s Secret Launch, Pixel 10’s Big Debut & EV Upheaval – Tech Roundup (Aug 21–22, 2025) ts2.tech

Compute Express Link 3.0 - Design And Reuse

Compute Express Link 3.0 Design And Reuse

Shift Power Reduction Methods and Effectiveness for Testability in ASIC - Design And Reuse

Shift Power Reduction Methods and Effectiveness for Testability in ASIC Design And Reuse

New Power Management IP Solution Can Dramatically Increase SoC Energy Efficiency - Design And Reuse

New Power Management IP Solution Can Dramatically Increase SoC Energy Efficiency Design And Reuse

Changing SoC Design Methodologies to Automate IP Integration and Reuse - Design And Reuse

Changing SoC Design Methodologies to Automate IP Integration and Reuse Design And Reuse

Transition Fixes in 3nm Multi-Voltage SoC Design - Design And Reuse

Transition Fixes in 3nm Multi-Voltage SoC Design Design And Reuse

Layout versus Schematic (LVS) Debug - Design And Reuse

Layout versus Schematic (LVS) Debug Design And Reuse

InCore Unveils SoC Generator Platform: From Idea to FPGA Validation in Minutes; Demonstrates Silicon Proof of Auto-Generated SoC - Design And Reuse

InCore Unveils SoC Generator Platform: From Idea to FPGA Validation in Minutes; Demonstrates Silicon Proof of Auto-Generated SoC Design And Reuse

7nm networking platform delivers unprecedented performance and configurability for data center ASICs - Design And Reuse

7nm networking platform delivers unprecedented performance and configurability for data center ASICs Design And Reuse

Streamlining SoC Integration With the Power of Automation - Design And Reuse

Streamlining SoC Integration With the Power of Automation Design And Reuse

Understanding mmWave RADAR, its Principle & Applications - Design And Reuse

Understanding mmWave RADAR, its Principle & Applications Design And Reuse

Embracing a More Secure Era with TLS 1.3 - Design And Reuse

Embracing a More Secure Era with TLS 1.3 Design And Reuse

A Deep Dive into AI-Driven Optimization with WiCkeD: The Optimization Powerhouse - Design And Reuse

A Deep Dive into AI-Driven Optimization with WiCkeD: The Optimization Powerhouse Design And Reuse

How Next-Gen Chips Are Unlocking RISC-V’s Customization Advantage - Design And Reuse

How Next-Gen Chips Are Unlocking RISC-V’s Customization Advantage Design And Reuse

Memory Testing - An Insight into Algorithms and Self Repair Mechanism - Design And Reuse

Memory Testing - An Insight into Algorithms and Self Repair Mechanism Design And Reuse

Accelerating SoC Evolution With NoC Innovations Using NoC Tiling for AI and Machine Learning - Design And Reuse

Accelerating SoC Evolution With NoC Innovations Using NoC Tiling for AI and Machine Learning Design And Reuse

Are we too Hard for Agile? - Design And Reuse

Are we too Hard for Agile? Design And Reuse

Improving design routability and timing by smart port reduction and placement technique - Design And Reuse

Improving design routability and timing by smart port reduction and placement technique Design And Reuse

Bridging Design Verification Gaps with Formal Verification - Design And Reuse

Bridging Design Verification Gaps with Formal Verification Design And Reuse

Refactoring to Prepare RTL for Reuse - Design And Reuse

Refactoring to Prepare RTL for Reuse Design And Reuse

Fundamentals of Semiconductor ISO 26262 Certification: People, Process and Product - Design And Reuse

Fundamentals of Semiconductor ISO 26262 Certification: People, Process and Product Design And Reuse

UPF Constraint coding for SoC - A Case Study - Design And Reuse

UPF Constraint coding for SoC - A Case Study Design And Reuse

TCP/IP Hardware Stack IP Core now Available from CAST - Design And Reuse

TCP/IP Hardware Stack IP Core now Available from CAST Design And Reuse

BOS Semiconductors Signed Development Contract for ADAS Chiplet SoC with an European OEM - Design And Reuse

BOS Semiconductors Signed Development Contract for ADAS Chiplet SoC with an European OEM Design And Reuse

MIPI deployment in ultra-low-power streaming sensors - Design And Reuse

MIPI deployment in ultra-low-power streaming sensors Design And Reuse

Design and Implementation of an OCP-IP Compliant 64-Node Butterfly Network on Chip on Multi-FPGA - Design And Reuse

Design and Implementation of an OCP-IP Compliant 64-Node Butterfly Network on Chip on Multi-FPGA Design And Reuse

Unified Methodology for Effective Correlation of SoC Power Estimation and Signoff - Design And Reuse

Unified Methodology for Effective Correlation of SoC Power Estimation and Signoff Design And Reuse

Cost Reduction and Improved TTR with Shared Scan-in DFT CODEC - Design And Reuse

Cost Reduction and Improved TTR with Shared Scan-in DFT CODEC Design And Reuse

Internal JTAG - A cutting-edge solution for embedded instrument testing in SoC: Part 2 - Design And Reuse

Internal JTAG - A cutting-edge solution for embedded instrument testing in SoC: Part 2 Design And Reuse

Enhancing VLSI Design Efficiency: Tackling Congestion and Shorts with Practical Approaches and PnR Tool (ICC2) - Design And Reuse

Enhancing VLSI Design Efficiency: Tackling Congestion and Shorts with Practical Approaches and PnR Tool (ICC2) Design And Reuse

Formal Property Checking for IP - A Case Study - Design And Reuse

Formal Property Checking for IP - A Case Study Design And Reuse

VLSI Physical Design Methodology for ASIC Development with a Flavor of IP Hardening - Design And Reuse

VLSI Physical Design Methodology for ASIC Development with a Flavor of IP Hardening Design And Reuse

Platform Based Design using a design meta-database - Design And Reuse

Platform Based Design using a design meta-database Design And Reuse

Understanding Logic Equivalence Check (LEC) Flow and Its Challenges and Proposed Solution - Design And Reuse

Understanding Logic Equivalence Check (LEC) Flow and Its Challenges and Proposed Solution Design And Reuse

Density Management in Analog Layout Design: Addressing Issues and Ensuring Consistency - Design And Reuse

Density Management in Analog Layout Design: Addressing Issues and Ensuring Consistency Design And Reuse

Advances in SoC and Processor Modeling Methodologies - Design And Reuse

Advances in SoC and Processor Modeling Methodologies Design And Reuse

Newracom Successfully Communicates with Wi-Fi HaLow, IEEE 802.11ah at a Distance Greater than 1 km - Design And Reuse

Newracom Successfully Communicates with Wi-Fi HaLow, IEEE 802.11ah at a Distance Greater than 1 km Design And Reuse

Optimizing Power Efficiency in SOC with PVT Sensor-Assisted DVFS Technology - Design And Reuse

Optimizing Power Efficiency in SOC with PVT Sensor-Assisted DVFS Technology Design And Reuse

FPGA Coprocessors: Hardware IP for Software Engineers - Design And Reuse

FPGA Coprocessors: Hardware IP for Software Engineers Design And Reuse

Analog IP Integration in SoC: Challenges and Solutions - Design And Reuse

Analog IP Integration in SoC: Challenges and Solutions Design And Reuse

Delivering timing accuracy in 5G networks - Design And Reuse

Delivering timing accuracy in 5G networks Design And Reuse

Advanced Power Management in Embedded Memory Subsystems - Design And Reuse

Advanced Power Management in Embedded Memory Subsystems Design And Reuse

Mixed-Signal IP Design Challenges in 28 nm and Beyond - Design And Reuse

Mixed-Signal IP Design Challenges in 28 nm and Beyond Design And Reuse

The ARM Cortex-A9 Processors - Design And Reuse

The ARM Cortex-A9 Processors Design And Reuse

Reusable MAC Design for Various Wireless Connectivity Protocols - Design And Reuse

Reusable MAC Design for Various Wireless Connectivity Protocols Design And Reuse

Switch Abstraction Interface (SAI) - Breaking the Network Aggregation - Design And Reuse

Switch Abstraction Interface (SAI) - Breaking the Network Aggregation Design And Reuse

IP-Based SOC Design in an in-house C-based design methodology - Design And Reuse

IP-Based SOC Design in an in-house C-based design methodology Design And Reuse

Novel and efficient power grid design for lesser metal layer process SOC's - Design And Reuse

Novel and efficient power grid design for lesser metal layer process SOC's Design And Reuse

Ultra Low Jitter Wide Band LC PLL - Design And Reuse

Ultra Low Jitter Wide Band LC PLL Design And Reuse

Semiconductor Industry Roundup (June–July 2025): Advanced Chips, Equipment, and Geopolitics - ts2.tech

Semiconductor Industry Roundup (June–July 2025): Advanced Chips, Equipment, and Geopolitics ts2.tech

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