DiSeTCom (GA823728)
Research
Kuopio, Pohjois-savo, Fi
126 employees
- Employees
- 126
DiSeTCom (GA823728) Overview
- Headquarters
- Kuopio, Pohjois-savo, Fi
- Website
- nano.bsu.by
- Industry
- Research
- Employees
- 126
- Founded
- 2019
About DiSeTCom (GA823728)
Grant Agreement number: 823728 — DiSeTCom — H2020-MSCA-RISE-2018 Start date: 1 March 2019 End date: 28 February 2023 Budget: 690.000 euro Coordinator: Prof. Yuri Svirko, University of Eastern Finland The main goal of DiSeTCom is to provide theoretical and experimental basis to build prototypes of the thinnest ever Terahertz (THz) lens and other alignment–free THz photonics components. Being based on 2D Dirac semimetals (graphene, silicene, germanene) and metamaterials paradigm they are capable to outdoing existing ones in terms of performance, footprint and tunability in lab-on-chip integrated solutions. Research Objectives: Finding constituent parameters of graphene, silicene and germanene with account for defects, doping, stacking, strain and external fields using ab initio and Tight Binding calculations. Revealing the microstructure features that govern the EM response of individual Dirac semimetals’ metaatoms (DiracMA) and their arrays. Development of feasible and easy to use techniques for fabrication of metaatoms and metasurfaces based on graphene, silicene, and germanene. Performing theoretical (with account for excitonic effects), numerical and experimental investigation of sandwich-like and 3D metasurfaces composed of DiracMA arrays in the THz frequency range. Designing and fabricating prototype of tunable and ultrathin (less than 1 micron thick) THz lens, filters, polarizers that capable to outperform existing ones in terms of footprint and efficiency. Innovation Objectives: Proof of concept experiments, fabrication and experimental validation of the THz components prototypes using metasurfaces composed of DiracMA with particular EM performance and tunability. Approaching TRL 3-4 (laboratory prototypes) in breakthrough THz technologies. Patent application. Exploitation plan. Analysing the environmental footprints of the fabrication process.
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