Elian Electronic Services Ltd

Elian specialise in small scale, quick turn prototype packaging and assembly tasks. The focus is to support small semiconductor companies with fast turn prototypes to support early development activity. Packaging at OSAT's can be time consuming and therefore Elian offer an alternative opportunity for "first look" assemblies delivered in much shorter cycle times. We can of course support other requests from non semiconductor companies. Capabilities Wire bond packaging - Chip On board/open top QFN/TO can/custom Die attach, wire bond and glob (if required). Custom rework - customer specific requests for modifications at package level. Rapid PCB Prototyping and assembly.