Ers Electronic Gmbh

Ers Electronic Gmbh company information, Employees & Contact Information

ERS electronic GmbH, based in the Munich suburb of Germering, has been providing innovative thermal management solutions to the semiconductor industry for more than 50 years. The company has gained an outstanding reputation, notably with its fast and accurate air cooling-based thermal chuck systems for test temperatures ranging from -65 °C to +550 °C for analytical, parameter-related and manufacturing probing. In 2008, ERS extended its expertise to the Advanced Packaging market. Today, their fully automatic and manual debonding and warpage adjust systems can be found on the production floors of most semiconductor manufacturers and OSATs worldwide. The company has received widespread recognition in the industry for their ability to tackle complex warpage issues that arise in the Fan-out wafer-level packaging manufacturing process. Our headquarter, sales department, engineering center and production facilities are in the Munich suburb of Germering, and we also have sales and support offices worldwide. Imprint: https://www.ers-gmbh.com/legal Privacy policy: https://www.ers-gmbh.com/privacy-policy

Company Details

Employees
61
Founded
-
Address
Stettiner Str. 3 + 5, Germering (Munich),d-82110,germany
Industry
Semiconductors
Keywords
IT Consulting.
HQ
Germering (Munich)
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News

ERS electronic Announces Agreement with Geringer Halbleitertechnik GmbH & Co. KG to Strengthen R&D and Production Capabilities - PR Newswire

ERS electronic Announces Agreement with Geringer Halbleitertechnik GmbH & Co. KG to Strengthen R&D and Production Capabilities PR Newswire

ERS electronic Appoints Mark Wachter as Chief Financial Officer - Business Wire

ERS electronic Appoints Mark Wachter as Chief Financial Officer Business Wire

ERS electronic offers improved warpage correction performance for Fan-out Wafer-Level Packaging with its Next-Generation WAT330 - PR Newswire APAC - 美通社

ERS electronic offers improved warpage correction performance for Fan-out Wafer-Level Packaging with its Next-Generation WAT330 - PR Newswire APAC 美通社

Warpage Metrology Tool for Advanced Packaging Wafers Launched - Metrology and Quality News

Warpage Metrology Tool for Advanced Packaging Wafers Launched Metrology and Quality News

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