Ev Group

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EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices and nanotechnology devices. Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world. More information about EVG is available at www.EVGroup.com.

Company Details

Employees
869
Founded
-
Address
Ev Group (Evg), Di Erich Thallner Str. 1,austria
Phone
43 7712 5311 0
Industry
Semiconductor Manufacturing
NAICS
Semiconductor and Other Electronic Component Manufacturing
HQ
St. Florian am Inn
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News

EV Group introduces die-to-wafer overlay system for chipmakers - Engineering.com

EV Group introduces die-to-wafer overlay system for chipmakers Engineering.com

EV group boosts digital lithography for AI chiplet packaging ... - eeNews Europe

EV group boosts digital lithography for AI chiplet packaging ... eeNews Europe

EV Group Brings Digital Lithography to Heterogeneous Integration HVM Applications with LITHOSCALE® XT - PR Newswire

EV Group Brings Digital Lithography to Heterogeneous Integration HVM Applications with LITHOSCALE® XT PR Newswire

EV Group advances 300-mm MEMS manufacturing with GEMINI wafer bonding system - New Electronics

EV Group advances 300-mm MEMS manufacturing with GEMINI wafer bonding system New Electronics

EV Group introduces LITHOSCALE XT for advanced HVM integration - Engineering.com

EV Group introduces LITHOSCALE XT for advanced HVM integration Engineering.com

EV Group Advances 300-mm MEMS Manufacturing with Next-Generation GEMINI® Automated Production Wafer Bonding System - PR Newswire

EV Group Advances 300-mm MEMS Manufacturing with Next-Generation GEMINI® Automated Production Wafer Bonding System PR Newswire

EV Group Forms Subsidiary in Singapore to Strengthen Local Customer Support - taiwannews.com.tw

EV Group Forms Subsidiary in Singapore to Strengthen Local Customer Support taiwannews.com.tw

EVG launches HERCULES NIL 300mm fully integrated lithography track system - Semiconductor Today

EVG launches HERCULES NIL 300mm fully integrated lithography track system Semiconductor Today

EV GROUP COMPLETES CONSTRUCTION OF NEW MANUFACTURING V BUILDING AT CORPORATE HEADQUARTERS TO EXPAND PRODUCTION CAPACITY - PR Newswire

EV GROUP COMPLETES CONSTRUCTION OF NEW MANUFACTURING V BUILDING AT CORPORATE HEADQUARTERS TO EXPAND PRODUCTION CAPACITY PR Newswire

EV Group Launches First-of-its-Kind Step-and-Repeat Mastering Services for Nanoimprint Lithography - PR Newswire

EV Group Launches First-of-its-Kind Step-and-Repeat Mastering Services for Nanoimprint Lithography PR Newswire

EV Group and Teramount Announce Collaboration to Implement Innovative Packaging Technologies for Photonic Integrated Circuits - PR Newswire

EV Group and Teramount Announce Collaboration to Implement Innovative Packaging Technologies for Photonic Integrated Circuits PR Newswire

EV GROUP DOUBLES THROUGHPUT OF INNOVATIVE SEMICONDUCTOR LAYER TRANSFER TECHNOLOGY WITH NEW EVG®880 LayerRelease™ SYSTEM - PR Newswire

EV GROUP DOUBLES THROUGHPUT OF INNOVATIVE SEMICONDUCTOR LAYER TRANSFER TECHNOLOGY WITH NEW EVG®880 LayerRelease™ SYSTEM PR Newswire

EV Group Achieves Die-to-Wafer Fusion and Hybrid Bonding Milestone with 100-Percent Die Transfer Yield on Multi-Die 3D System-on-a-Chip - PR Newswire

EV Group Achieves Die-to-Wafer Fusion and Hybrid Bonding Milestone with 100-Percent Die Transfer Yield on Multi-Die 3D System-on-a-Chip PR Newswire

EV Group Invests 30 Million Euros for Capacity Expansion at Corporate Headquarters in Austria - PR Newswire

EV Group Invests 30 Million Euros for Capacity Expansion at Corporate Headquarters in Austria PR Newswire

EV Group Unveils Hybrid Die-To-Wafer Bonding Activation Solution To Speed Up Deployment Of 3D Heterogeneous Integration - PR Newswire

EV Group Unveils Hybrid Die-To-Wafer Bonding Activation Solution To Speed Up Deployment Of 3D Heterogeneous Integration PR Newswire

EV Group Unveils Next-Generation Fusion Wafer Bonder for "More Moore" Scaling and Front-End Processing - PR Newswire

EV Group Unveils Next-Generation Fusion Wafer Bonder for "More Moore" Scaling and Front-End Processing PR Newswire

EV Group Receives Multiple Lithography and Metrology System Orders for Wafer-Level Optics Manufacturing - PR Newswire

EV Group Receives Multiple Lithography and Metrology System Orders for Wafer-Level Optics Manufacturing PR Newswire

EV Group highlights revolutionary temporary wafer bonding and debonding solution for HBM and 3D DRAM at SEMICON Korea - Yole Group

EV Group highlights revolutionary temporary wafer bonding and debonding solution for HBM and 3D DRAM at SEMICON Korea Yole Group

Maskless lithography system for high-volume manufacturing ... - eeNews Europe

Maskless lithography system for high-volume manufacturing ... eeNews Europe

EV Group Unveils Breakthrough Low-temperature Laser Debonding Solution For Fan-out Wafer-level Packaging - PR Newswire

EV Group Unveils Breakthrough Low-temperature Laser Debonding Solution For Fan-out Wafer-level Packaging PR Newswire

EVG launches next-gen 200mm EVG150 automated resist processing platform - Semiconductor Today

EVG launches next-gen 200mm EVG150 automated resist processing platform Semiconductor Today

Collective die-to-wafer bonding with sub-2μm accuracy for 3D packaging - eeNews Europe

Collective die-to-wafer bonding with sub-2μm accuracy for 3D packaging eeNews Europe

EVG launches automated SmartNIL nanoimprint and wafer-level optics system - Semiconductor Today

EVG launches automated SmartNIL nanoimprint and wafer-level optics system Semiconductor Today

Leti Demonstrates World's First 300-mm Wafer-to-Wafer Direct Hybrid Bonding with 1-Micron Pitch on EV Group System - PR Newswire

Leti Demonstrates World's First 300-mm Wafer-to-Wafer Direct Hybrid Bonding with 1-Micron Pitch on EV Group System PR Newswire

EV Group Brings Revolutionary Layer Transfer Technology to High-Volume Manufacturing with EVG®850 NanoCleave™ System - Macau Business

EV Group Brings Revolutionary Layer Transfer Technology to High-Volume Manufacturing with EVG®850 NanoCleave™ System Macau Business

EV Group brings 300-mm wafer bonding to MEMS manufacturing with GEMINI® automated wafer bonder - Yole Group

EV Group brings 300-mm wafer bonding to MEMS manufacturing with GEMINI® automated wafer bonder Yole Group

Nanoimprint Lithography Enables Cost-Effective Photonics Production | Features | Feb 2015 - Photonics Spectra

Nanoimprint Lithography Enables Cost-Effective Photonics Production | Features | Feb 2015 Photonics Spectra

EV Group Ramps Nanoimprint Lithography into High-volume Manufacturing with HERCULES® NIL Track System - PR Newswire

EV Group Ramps Nanoimprint Lithography into High-volume Manufacturing with HERCULES® NIL Track System PR Newswire

EVG and Plessey partner on GaN-on-Si monolithic micro-LED technology for AR applications - Semiconductor Today

EVG and Plessey partner on GaN-on-Si monolithic micro-LED technology for AR applications Semiconductor Today

EVG partners with NSI on wafer-level heterogeneous integration of GaAs-on-Si for RF front-end modules - Semiconductor Today

EVG partners with NSI on wafer-level heterogeneous integration of GaAs-on-Si for RF front-end modules Semiconductor Today

Imec and EVG demonstrate for the first time 1.8µm pitch overlay accuracy for wafer bonding - Yole Group

Imec and EVG demonstrate for the first time 1.8µm pitch overlay accuracy for wafer bonding Yole Group

EVG ramps nanoimprint lithography into high-volume manufacturing with HERCULES NIL track system - Semiconductor Today

EVG ramps nanoimprint lithography into high-volume manufacturing with HERCULES NIL track system Semiconductor Today

EVG and Teramount collaborate on packaging technologies for PICs - Semiconductor Today

EVG and Teramount collaborate on packaging technologies for PICs Semiconductor Today

EV Group and Panasonic Team Up on Resist Processing Solution for Plasma Dicing - PR Newswire

EV Group and Panasonic Team Up on Resist Processing Solution for Plasma Dicing PR Newswire

EVG completes latest phase of production capacity expansion - Semiconductor Today

EVG completes latest phase of production capacity expansion Semiconductor Today

EVG unveils covalent bonder for engineered substrate and power device production - Semiconductor Today

EVG unveils covalent bonder for engineered substrate and power device production Semiconductor Today

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