FlipChip International (FCI) supplies turnkey semiconductor assembly and test services to the consumer, automotive, aerospace and medical industries through our leadership in high volume wafer level packaging and advanced packaging technologies. FCI was an early developer of Wafer-Level Chip Scale Packaging and remains the technology leader in this field with many patented technologies spanning from Cu Pillar Bumping, Spheron™ WLCSP, ChipsetT™ Embedded Die Packaging, and FlipChip on Leadframe assembly. FCI supports a wide range of customers from each industry, frequently partnering with them to engineer customized solutions. FCI has a global footprint, offering high volume advanced packaging services from ISO/TS 16949-certified factories located in Phoenix, Arizona, USA, and Shanghai, China
Company Details
- Employees
- 73
- Founded
- 2004
- Address
- 3701 E University, Phoenix,arizona 85034,united States
- Phone
- 6024372739
- Industry
- Semiconductor Manufacturing
- NAICS
-
Semiconductor and Other Electronic Component Manufacturing
- Website
- flipchip.com
- Keywords
- Semiconductor Wafer Solder Bumping (WLCSP), Multi Project Wafers, Semiconductor Assembly and Test, and Backgrind, Wafer Saw, Tape and Reel, Laser Mark.
- HQ
- Phoenix, Arizona
Flipchip International Questions
Flipchip International's helpline number is 6024372739
Flipchip International's website is flipchip.com
Flipchip International's LinkedIn profile is https://www.linkedin.com/company/flipchip-international
Flipchip International has
73 employees.
View email and phone details for 73
employees at Flipchip International.
Flipchip International's industry is
Semiconductor Manufacturing
Flipchip International's top competitors are
Micron Ems Tech Pvt Ltd,
Amkor Technology Korea,
Flipchip Electronics Private Limited,
Entrepix,
Amkor Technology, Inc.,
Applied Materials,
Asm,
Cofan Thermal,
Golden Altos,
Btu International.
Flipchip International's categories are Semiconductor Manufacturing
Flipchip International's founding year is 2004
