Group Up Industrial Co., Ltd

Since our establishment in 1990, we have adhered to the belief of "Quality First, Service Foremost“, focusing on the core technologies - "Coating," "Drying," and "Laminating." Through automated integration, we have successfully enhanced the equipment capacity and precision. Printed Circuit Boards (PCBs) lay the foundation for us, keeping pace with global trends, we are a leading global supplier of equipment for Flexible Printed Circuits (FPCs) and IC substrates, maintaining a high market share worldwide. Building on our solid industry experience, we have expanded into FO PLP and TGV market, continuously innovating and evolving with the times. Developing core competencies and solutions in hot air, infrared, ultraviolet, hot plate, vacuum, coating, lamination, automation and line integration. Markets served for Semiconductor advanced Package, BGA, PCB, FPC, COF, Display, Touch Panel, Back Light, Solar Cell, Smart Card, Optical Film, and Battery industries.