Grinding And Dicing Services Inc

Grinding And Dicing Services Inc company information, Employees & Contact Information

The most experienced US supplier targeting complex wafer dicing and grinding services for diverse market segments including semiconductor, MEMS and life sciences to name a few. Continuity of support from NPI to commercial scale manufacturing for both commercial and military applications. Robust Static and Cleanliness controls capable of the most demanding specifications. GDSI is ISO 9001:2008 registered. Serving fab and fabless interests for over 20 Years. Why gamble with your material? Trust GDSI to process your critical projects. Specialties: Wafer dicing, Stealth Laser Dicing Process, wafer grinding, thinning, polish, inspection, wafer saw, SiC, Glass, Silicon, MEMS, pick & place, 300mm, Die Bonding

Company Details

Employees
6
Founded
-
Address
925 Berryessa Rd, San Jose,california,united States
Phone
408-961-3720
Email
sa****@****ing.com
Industry
Semiconductor Manufacturing
NAICS
Semiconductor and Other Electronic Component Manufacturing
Keywords
Wafer dicing.
HQ
San Jose, California
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