Grinding And Dicing Services Inc

Grinding And Dicing Services Inc company information, Employees & Contact Information

Updated June 2026

Quick answer

Grinding And Dicing Services Inc is a Semiconductor Manufacturing company and founded in 1992. It has approximately 6 employees on record. Contact data was last refreshed in June 2026. Find Grinding And Dicing Services Inc's verified employee emails, phone numbers, headquarters address, and key decision makers below.

The most experienced US supplier targeting complex wafer dicing and grinding services for diverse market segments including semiconductor, MEMS and life sciences to name a few. Continuity of support from NPI to commercial scale manufacturing for both commercial and military applications. Robust Static and Cleanliness controls capable of the most demanding specifications. GDSI is ISO 9001:2008 registered. Serving fab and fabless interests for over 20 Years. Why gamble with your material? Trust GDSI to process your critical projects. Specialties: Wafer dicing, Stealth Laser Dicing Process, wafer grinding, thinning, polish, inspection, wafer saw, SiC, Glass, Silicon, MEMS, pick & place, 300mm, Die Bonding

Company Details

Employees
6
Founded
1992
Address
925 Berryessa Rd, San Jose,california,united States
Phone
408-961-3720
Email
sa****@****ing.com
Industry
Semiconductor Manufacturing
NAICS
Semiconductor and Other Electronic Component Manufacturing
Keywords
Wafer dicing.
HQ
San Jose, California
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