Grinding and Dicing Services Inc

Grinding and Dicing Services Inc

Semiconductor Manufacturing San Jose, California, United States 6 employees
Employees
6
Contacts
1
Emails
1
Phones
1

Grinding and Dicing Services Inc Overview

Headquarters
San Jose, California, United States
Phone Number
Available in AeroLeads
Website
wafergrind.com
Industry
Semiconductor Manufacturing
Employees
6
Founded
1992
Company Email
Available in AeroLeads
NAICS
Semiconductor and Other Electronic Component Manufacturing
Keywords

About Grinding and Dicing Services Inc

The most experienced US supplier targeting complex wafer dicing and grinding services for diverse market segments including semiconductor, MEMS and life sciences to name a few. Continuity of support from NPI to commercial scale manufacturing for both commercial and military applications. Robust Static and Cleanliness controls capable of the most demanding specifications. GDSI is ISO 9001:2008 registered. Serving fab and fabless interests for over 20 Years. Why gamble with your material? Trust GDSI to process your critical projects. Specialties: Wafer dicing, Stealth Laser Dicing Process, wafer grinding, thinning, polish, inspection, wafer saw, SiC, Glass, Silicon, MEMS, pick & place, 300mm, Die Bonding

Grinding and Dicing Services Inc Contact Details

People in AeroLeads
2
With contact data
1
Email contacts
1
50.0% coverage
Phone contacts
1
50.0% coverage

Grinding and Dicing Services Inc Org Chart

Sample employees and titles
Name Title Contact
Sokhavy Lay Customer Service and Shipping Specialist
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Joe Collins President - Grinding & Dicing Services Inc. - Stateside Partner for Critical Die Prep Services
Email Phone

Employees by Management Level

Individual contributor 2 profiles
Executive 1 profile
Manager 1 profile

Department Contact Coverage

Department Contacts Email Phone
General 2 2 0

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