H2020-Caladan

The CALADAN project brings together a supply chain that will enable automatic wafer-scale assembly of Terabit/s capable optical engines through the use of the micro transfer printing technology. Both SiGe BiCMOS driver and receiver chiplets (fabricated using a modified version of an established SiGe process), as well as GaAs quantum dot laser coupons will be transfer printed on 300mm Silicon Photonic wafers. The purpose is the parallel assembly of optical transceiver engines, thus significantly reducing production costs compared to conventional sequential flip-chip assembly processes. In addition fast vision-based automatic fiber attachment equipment and processes are being developed, again with the view to lower the cost associated with manufacturing of ultra high-speed optical transceivers. The European project Caladan is an initiative of the Photonics Public Private Partnership (PPP), and has received funding from the European Union’s Horizon 2020 innovation programme under grant agreement No 825453.