Holistep

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To achieve ever shrinking dimensions and higher resolutions of circuit elements, projection lithography (PL), is growing in complexity and cost to manufacturers. It is limited to producing 2D images on flat surfaces. Extension to 3D imaging is restricted by trade-off between focus depth and resolution. Advanced, cost-efficient solutions to fabricate wafer-scale 3D components are required. HoLiSTEP unleashes the potential of sub-wavelength Holographic Lithography (HL) as a powerful and enabling disruptive lithography. HL will overcome limitations of PL and facilitate production of novel 3D topographies with high resolution while making the production of high resolution IC much more affordable.

Company Details

Employees
1
Address
Dresden
Industry
Research Services
NAICS
Scientific Research and Development Services
Research and Development in the Physical, Engineering, and Life Sciences
Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)
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