ICEPT

The International Conference on Electronic Packaging Technology (ICEPT) has been recognized as one of the top four electronic packaging academic conference, which is hosted by Institute of Microelectronics of Chinese Academy of Sciences (IMECAS) and Shihezi University. Organized by College of Mechanical and Electrical Engineering, Shihezi University and BeiJing HengRenZhiXin Consulting Company, China. Co-organized by IEEE Electronics Packaging Society (IEEE-EPS)、Electronic Manufacturing & Packaging Technology Society of Chinese Institute of Electronics (CIE-EMPT)，National Center for Advanced Packaging Co., Ltd.( NCAP China）. ICEPT held in China every year, conference topics including Packaging Design、Manufacturing Technologies、R&D, and Photonics、MEMS、System Integrated Packaging etc..., since it inaugurated in 1994, ICEPT has been held by Tsinghua University, Fudan University, Harbin Institute of technology, Huazhong University of science and technology, Shanghai Jiaotong University, Xi'an University of Electronic Science and technology, Shanghai University, Guilin University of Electronic Science and technology, Dalian University of technology, University of Electronic Science and technology, Central South University, Hong Kong University of science and technology, Guangdong University of technology and other universities for more than 20 sessions, and supported by relevant government units at all levels. ICEPT attracts a large number of domestic and foreign universities, research institutions, electronic packaging manufacturers participate, more than 500 Well known experts, scholars and business people from about 20 countries and regions.