iNPACK- IC Packaging
Semiconductor Manufacturing
3321 Doris Avenue
5 employees
- Employees
- 5
iNPACK- IC Packaging Overview
- Headquarters
- 3321 Doris Avenue
- Website
- www.pcb-technologies.com
- Industry
- Semiconductor Manufacturing
- Employees
- 5
- NAICS
-
Semiconductor and Other Electronic Component Manufacturing
About iNPACK- IC Packaging
iNPACK goes beyond design limits to offer you cutting edge semiconductor and electronics assembly, testing and IC package design including LGA, BGA and 2D & 3D customized solutions. Featuring fully supported automated processes, MW microelectronics assemblies, System-in-Package (SiP) & heterogeneous integration. We also offer high level expertise in organic substrate design and manufacturing based on advanced materials, subtractive and mSAP processes.
iNPACK- IC Packaging Contact Details
- People in AeroLeads
- 3
iNPACK- IC Packaging Org Chart
Sample employees and titles| Name | Title | Location | Contact |
|---|---|---|---|
| Sharon Magalnik | Process Engineer | Haifa, Haifa District, Israel |
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|
| Hisday Cohen | Materials Engineer | Ramat Yishai, North District, Israel |
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|
| Shahar Avitov | Project Engineer | Haifa District, Israel |
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|
Employees by Management Level
Individual contributor
3 profiles
iNPACK- IC Packaging Tech Stack
Engineering
3 profiles
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