Kenji Technology Sdn Bhd

Kenji Technology Sdn Bhd is a Malaysia-based company with over 20 years of experience serving the semiconductor industry. We specialize in supplying high-performance materials and technical support for back-end manufacturing processes, including mold cleaning solutions, mold tools and dies, and back grinding tools. Since our founding in 2003, Kenji has established a strong reputation for reliability, product quality, and hands-on customer service. We work closely with multinational semiconductor manufacturers to help improve quality and reduce machine downtime. Our mold cleaning solutions are developed to remove residue and carbon from molding surfaces without damaging the tools. We also supply precision-engineered cavities, pots, and plungers that meet tight tolerances and production requirements. Our back grinding and polishing tools support consistent wafer thinning for advanced packaging needs. What sets us apart is our commitment to technical support. We provide on-site assistance, evaluations, and troubleshooting to ensure our solutions integrate seamlessly into our customers' operations. Kenji Technology remains committed to expanding our solutions, supporting semiconductor manufacturers across Southeast Asia, and delivering value through experience, responsiveness, and results.