LB Semicon, Inc.

LB Semicon is a leading global provider of outsourced semiconductor packaging and test services. Established in 2000, the company has rapidly advanced in the IC packaging and test industry, becoming a key manufacturing partner for top semiconductor firms, foundries, and electronics companies worldwide. LB Semicon operates production facilities, product development centers, and sales and support offices across major electronics manufacturing hubs in Korea, Asia, and the USA. The company offers a comprehensive range of services, including wafer bumping, redistribution services, wafer probing, die processing, wafer-level packaging, and chip-on-film packaging. These high-quality packaging and test services enable customers to concentrate on semiconductor design and wafer fabrication, relying on LB Semicon as their technology leader in packaging and test solutions. LB Semicon's advanced packaging technologies include Fan-Out WLP and advanced copper pillar bumping, while their test services support a variety of applications such as CIS, PMIC, SoC, DDI, and Recon. Guided by the principle of "Look Beyond," LB Semicon is committed to ongoing innovation and excellence, positioning itself as a dependable partner and integrated packaging solution provider.