Nepes Company Profile, Contacts & Intelligence

Semiconductor ManufacturingKorea, Kr199 employeesFounded 1990
2 contacts with email or phone data2 with email data
View verified contacts Compare competitors
Employees
199
Company source estimate
Reachable Contacts
2
Visible contacts with email or phone data
Contacts With Email
2
2 of 4 visible contacts

Nepes Overview

Nepes corporation, founded in 1990, has been providing bumping and wafer-level package OSAT manufacturing services in partnership with Fabless and IDM customers worldwide since 2001. Nepes provides turn-key solution of IC back-end service for 8″ and 12″ wafer with reliable quality by implementing mainstream technology from the wafer bumping, IC packaging and testing. The Company’s portfolio of products covers Wafer level package(WLP), System in package(SiP) and Fan-out panel level package(FOPLP). Nepes has manufacturing sites in South Korea, Philippines and China and international sales offices in San Diego, CA, Shanghai, China and Taiwan.

Headquarters
Korea, Kr
Website
nepes.co.kr
Industry
Semiconductor Manufacturing
Founded
1990
NAICS
Semiconductor and Other Electronic Component Manufacturing
semiconductor

Nepes Contact Intelligence

See which contact channels and departments are represented in the visible AeroLeads data.

2 contacts with contact data
2 with email data in the visible sample.

Nepes People & Org Chart Preview

Sample people records show job titles and whether email or phone data is available without exposing raw contact details.

L
Lewis(in-soo) Kang
Senior Vice President of Chiplet R&D & New Biz Development
S
Sangjae Lee
SVP, Head of Business Development Division at Nepes Corp.
S
Seahee Lee
Chief Executive Officer at Nepes Enc. Hotel West of Canaan
E
K
Ki Soo Park
Nepes Future Intelligence Business Analyst
E

Nepes Workforce Composition

Seniority breakdown across 4 visible profiles.

Executive
2
VP / Head
1
Individual contributor
1

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