Deca Technologies

Deca Technologies company information, Employees & Contact Information

Deca was born of a passion to transform the way the world builds advanced electronic devices. In our first decade, our 10X thinking brought to life exciting breakthroughs for leading mobile semiconductor companies. From initial applications in traditional semiconductor packaging, to the growth of chiplets and heterogeneous integration, we have created key foundational building blocks for the future. Our world class investors, including Infineon, Qualcomm, ASE, nepes and SunPower, are respected industry leaders who provide us with the strength and visibility to create an entirely new model. Our flagship product, M-Series™, is a rugged, fully molded fan-out wafer-level package (FOWLP) that provides exceptional reliability, performance, and quality; all in a miniaturized format. M-Series FX is designed into most of the leading smartphones around the globe with annual shipment volumes in the hundreds of millions. Adaptive Patterning™ (AP) fundamentally revitalizes the spirit of innovation in manufacturing. Extending beyond traditional Design for Manufacturing (DFM), our unique Design-During-Manufacturing (DDM) adapts each design in real-time to accommodate natural process variation producing perfectly aligned interconnects every time on every device. Through the divestiture of our manufacturing operations in early 2020, we transformed into a pure-play technology provider. We are building upon our highly successful technology transfer and license agreements with ASE and nepes to make M-Series and AP technologies available to the industry as emerging standards for advanced fan-out and related technologies.

Company Details

Employees
196
Founded
-
Address
7855 S.river Parkway, Tempe,arizona 85284,united States
Phone
4803459897
Email
in****@****ies.com
Industry
Semiconductor Manufacturing
NAICS
Semiconductor and Other Electronic Component Manufacturing
HQ
Tempe, Arizona
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News

Deca Announces Agreement with IBM to Bring High-Density Fan-Out Interposer Production to North America - GlobeNewswire

Deca Announces Agreement with IBM to Bring High-Density Fan-Out Interposer Production to North America GlobeNewswire

ASU and Deca Technologies selected to lead $100M SHIELD USA project to strengthen U.S. semiconductor packaging capabilities - ASU News

ASU and Deca Technologies selected to lead $100M SHIELD USA project to strengthen U.S. semiconductor packaging capabilities ASU News

RRP Electronics partners with Deca Technologies - Business Standard

RRP Electronics partners with Deca Technologies Business Standard

ASU and Deca Technologies team up for first such microchip research in North America - azcentral.com and The Arizona Republic

ASU and Deca Technologies team up for first such microchip research in North America azcentral.com and The Arizona Republic

Deca Technologies — Part 2: Adaptive Patterning - EE Times

Deca Technologies — Part 2: Adaptive Patterning EE Times

Deca Technologies’ Founder and CEO Tim Olson Receives Founder’s Award at 55th IMAPS Symposium - GlobeNewswire

Deca Technologies’ Founder and CEO Tim Olson Receives Founder’s Award at 55th IMAPS Symposium GlobeNewswire

ASU, Deca Technologies partner on advanced packaging research and development - ASU News

ASU, Deca Technologies partner on advanced packaging research and development ASU News

Deca Technologies, Part 1 – Spinning Square Platters - EE Times

Deca Technologies, Part 1 – Spinning Square Platters EE Times

Advanced Fan-out Technology Breakthrough: Deca - GlobeNewswire

Advanced Fan-out Technology Breakthrough: Deca GlobeNewswire

nepes Corporation to Acquire Deca Technologies Manufacturing Operations - GlobeNewswire

nepes Corporation to Acquire Deca Technologies Manufacturing Operations GlobeNewswire

Deca collaborates with ASE and Siemens to launch APDK™ design methodology - GlobeNewswire

Deca collaborates with ASE and Siemens to launch APDK™ design methodology GlobeNewswire

Deca Partners with ADTEC Engineering to Enhance Adaptive Patterning™ for 2µm Chiplet Scaling - GlobeNewswire

Deca Partners with ADTEC Engineering to Enhance Adaptive Patterning™ for 2µm Chiplet Scaling GlobeNewswire

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