Tim Olson

Tim Olson Email and Phone Number

CEO at Deca Technologies @ Deca Technologies
Tim Olson's Location
Phoenix, Arizona, United States, United States
About Tim Olson

History of multiple successes in establishing new businesses, developing new technologies, introducing new products and building advanced operations across the electronics and semiconductor industries. Strong communication skills and experience with public & private company boards, Wall Street analysts and C-level executives throughout the electronics industry from end device OEMs, to semiconductor producers to suppliers of equipment, materials, IT and services. Exceptional awareness of customers and emerging market needs enabling the creation of unique solutions for future business growth opportunities. Invited keynote speaker at several semiconductor industry conferences and events.Led the development and introduction of numerous new technologies within the semiconductor industry including two-dimensional codes (2D codes) from the national aeronautics and space agency (NASA) for tracking & traceability, strip-based final electrical test with associated strip mapping management software, multiple new semiconductor packaging technologies including analog power SiP & PFP, PoP TMV™, FusionQuad™, fine pitch Cu pillar flip chip as well as M-Series™ fan-out technology with Adaptive Patterning™.Strong senior leader skilled in Business Development, Advanced Technology Development, Equipment Management, Software Management, Technology Management, Operations Management, Senior Management and Research and Development (R&D).

Tim Olson's Current Company Details
Deca Technologies

Deca Technologies

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CEO at Deca Technologies
Tim Olson Work Experience Details
  • Deca Technologies
    Ceo
    Deca Technologies 2009 - Present
    Tempe, Arizona, Us
    Building upon a decade of innovation with M-Series™ fan-out and Adaptive Patterning™ technologies, Deca is now positioned to enable the industry as a pure play technology provider. Our company has divested its manufacturing operations and is now continuing development and delivering our powerful technologies through technology transfers, licensing agreements, technology development cooperation and other engagements.
  • Deca Technologies
    Founder & Cto
    Deca Technologies Jul 2013 - Feb 2020
    Tempe, Arizona, Us
    Leading the development and implementation of our unique M-Series electronic interconnect technology enabling next generation single & multi-die packaging, fan-out SoCs and advanced electronic systems. Includes structure, materials, processes, wafer fab Autoline manufacturing equipment and factory automation. M-Series fan-out technology is aimed at enabling complete electronic systems with wafer fab BEOL-like interconnect of disparate silicon functional blocks and other components fully embedded within a rugged plastic structure.
  • Deca Technologies
    Founder, President & Ceo
    Deca Technologies Aug 2009 - Jul 2013
    Tempe, Arizona, Us
    Through the support of Cypress Semiconductor and SunPower's unique solar wafer fab techniques, Deca Technologies has a created a breakthrough approach to wafer level packaging, wafer & panel level fan-out technology as well as additional innnovations in electronic systems interconnect. Deca serves industry leading semiconductor companies and electronic systems OEMs with unprecedented speed, value, flexibility and technology.
  • Amkor Technology
    Senior Vice President - R&D And Emerging Technologies
    Amkor Technology Mar 2003 - Aug 2009
    Tempe, Arizona, Us
    Led the global R&D organization as several key innovations were introduced to the market including PoP TMV* (Package on Package Through Mold Via) technology, FusionQuad* and fine pitch Cu pillar flip chip technology. Created the micro-EMS business unit by developing direct technology and business relationships with leading electronic systems OEMs. Managed revenue growth and increased profitability of the $700M+ legacy lead frame packaging business while simultaneously growing an emerging technologies business focused on SiP (System in Package) modules.*Note: TMV and FusionQuad are trademarks of Amkor
  • Mct - Micro Component Technology
    Executive Vice President - Products & Operations
    Mct - Micro Component Technology 1999 - 2003
    Tempe, Arizona, Us
    Led global manufacturing operations, product development, research & development, marketing and software systems. Major products included strip test handling, test system interfaces, 2D code based strip tracking and traceability software and yield management systems.
  • Fico B.V. (Now Besi)
    Vice President - System Integration Division
    Fico B.V. (Now Besi) 1997 - 1999
    Established Systems Integration division with operations in Holland, US and Asia. Created the industry's first commercial strip test handler and supporting automation software. Delivered strip-based mapping to the industry enabling leadframe and substrate operations with powerful individual device traceability capability inspired by wafer mapping systems utilized within foundries. Developed multiple advanced pieces of semiconductor manufacturing equipment, together with integration software and factory control systems.
  • Motorola
    Operations Manager - Prism
    Motorola 1987 - 1997
    Chicago, Illinois, Us
    Led the creation, development, implementation and operation of the industry leading automated and integrated PRISM semiconductor assembly and test factory within Motorola Semiconductor serving top automotive and cellular OEMs. Pioneered the concept of individual device traceability through utilization of 2D codes first used by NASA and implementation of the industry's first strip test application in high volume production. Created multiple new packaging technologies enabling SMARTMOS device technology to be implemented in automotive power train applications as well as GaAs PA devices within cellular handsets.

Tim Olson Skills

Semiconductors Electronics Manufacturing Semiconductor Industry R&d Product Development Cross Functional Team Leadership Engineering Management Ic Testing Integration Rf Design Of Experiments Spc Product Management Fmea Failure Analysis Start Ups Continuous Improvement Process Engineering Six Sigma Engineering Mems Materials Science Management Lean Manufacturing Analog Product Engineering Business Strategy Thin Films Characterization Metrology Reliability Automation Process Improvement International Marketing Strategy Process Simulation Mixed Signal Design For Manufacturing Silicon Soc Operations Management Eda Asic Simulations Sensors Cmos Microelectronics Jmp

Tim Olson Education Details

  • University Of North Dakota
    University Of North Dakota
    Engineering & Management
  • Fergus Falls Community College
    Fergus Falls Community College
    Physical Sciences

Frequently Asked Questions about Tim Olson

What company does Tim Olson work for?

Tim Olson works for Deca Technologies

What is Tim Olson's role at the current company?

Tim Olson's current role is CEO at Deca Technologies.

What is Tim Olson's email address?

Tim Olson's email address is to****@****aol.com

What is Tim Olson's direct phone number?

Tim Olson's direct phone number is +160246*****

What schools did Tim Olson attend?

Tim Olson attended University Of North Dakota, Fergus Falls Community College.

What skills is Tim Olson known for?

Tim Olson has skills like Semiconductors, Electronics, Manufacturing, Semiconductor Industry, R&d, Product Development, Cross Functional Team Leadership, Engineering Management, Ic, Testing, Integration, Rf.

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