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History of multiple successes in establishing new businesses, developing new technologies, introducing new products and building advanced operations across the electronics and semiconductor industries. Strong communication skills and experience with public & private company boards, Wall Street analysts and C-level executives throughout the electronics industry from end device OEMs, to semiconductor producers to suppliers of equipment, materials, IT and services. Exceptional awareness of customers and emerging market needs enabling the creation of unique solutions for future business growth opportunities. Invited keynote speaker at several semiconductor industry conferences and events.Led the development and introduction of numerous new technologies within the semiconductor industry including two-dimensional codes (2D codes) from the national aeronautics and space agency (NASA) for tracking & traceability, strip-based final electrical test with associated strip mapping management software, multiple new semiconductor packaging technologies including analog power SiP & PFP, PoP TMV™, FusionQuad™, fine pitch Cu pillar flip chip as well as M-Series™ fan-out technology with Adaptive Patterning™.Strong senior leader skilled in Business Development, Advanced Technology Development, Equipment Management, Software Management, Technology Management, Operations Management, Senior Management and Research and Development (R&D).
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CeoDeca Technologies 2009 - PresentTempe, Arizona, UsBuilding upon a decade of innovation with M-Series™ fan-out and Adaptive Patterning™ technologies, Deca is now positioned to enable the industry as a pure play technology provider. Our company has divested its manufacturing operations and is now continuing development and delivering our powerful technologies through technology transfers, licensing agreements, technology development cooperation and other engagements. -
Founder & CtoDeca Technologies Jul 2013 - Feb 2020Tempe, Arizona, UsLeading the development and implementation of our unique M-Series electronic interconnect technology enabling next generation single & multi-die packaging, fan-out SoCs and advanced electronic systems. Includes structure, materials, processes, wafer fab Autoline manufacturing equipment and factory automation. M-Series fan-out technology is aimed at enabling complete electronic systems with wafer fab BEOL-like interconnect of disparate silicon functional blocks and other components fully embedded within a rugged plastic structure. -
Founder, President & CeoDeca Technologies Aug 2009 - Jul 2013Tempe, Arizona, UsThrough the support of Cypress Semiconductor and SunPower's unique solar wafer fab techniques, Deca Technologies has a created a breakthrough approach to wafer level packaging, wafer & panel level fan-out technology as well as additional innnovations in electronic systems interconnect. Deca serves industry leading semiconductor companies and electronic systems OEMs with unprecedented speed, value, flexibility and technology. -
Senior Vice President - R&D And Emerging TechnologiesAmkor Technology Mar 2003 - Aug 2009Tempe, Arizona, UsLed the global R&D organization as several key innovations were introduced to the market including PoP TMV* (Package on Package Through Mold Via) technology, FusionQuad* and fine pitch Cu pillar flip chip technology. Created the micro-EMS business unit by developing direct technology and business relationships with leading electronic systems OEMs. Managed revenue growth and increased profitability of the $700M+ legacy lead frame packaging business while simultaneously growing an emerging technologies business focused on SiP (System in Package) modules.*Note: TMV and FusionQuad are trademarks of Amkor -
Executive Vice President - Products & OperationsMct - Micro Component Technology 1999 - 2003Tempe, Arizona, UsLed global manufacturing operations, product development, research & development, marketing and software systems. Major products included strip test handling, test system interfaces, 2D code based strip tracking and traceability software and yield management systems. -
Vice President - System Integration DivisionFico B.V. (Now Besi) 1997 - 1999Established Systems Integration division with operations in Holland, US and Asia. Created the industry's first commercial strip test handler and supporting automation software. Delivered strip-based mapping to the industry enabling leadframe and substrate operations with powerful individual device traceability capability inspired by wafer mapping systems utilized within foundries. Developed multiple advanced pieces of semiconductor manufacturing equipment, together with integration software and factory control systems.
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Operations Manager - PrismMotorola 1987 - 1997Chicago, Illinois, UsLed the creation, development, implementation and operation of the industry leading automated and integrated PRISM semiconductor assembly and test factory within Motorola Semiconductor serving top automotive and cellular OEMs. Pioneered the concept of individual device traceability through utilization of 2D codes first used by NASA and implementation of the industry's first strip test application in high volume production. Created multiple new packaging technologies enabling SMARTMOS device technology to be implemented in automotive power train applications as well as GaAs PA devices within cellular handsets.
Tim Olson Skills
Tim Olson Education Details
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University Of North DakotaEngineering & Management -
Fergus Falls Community CollegePhysical Sciences
Frequently Asked Questions about Tim Olson
What company does Tim Olson work for?
Tim Olson works for Deca Technologies
What is Tim Olson's role at the current company?
Tim Olson's current role is CEO at Deca Technologies.
What is Tim Olson's email address?
Tim Olson's email address is to****@****aol.com
What is Tim Olson's direct phone number?
Tim Olson's direct phone number is +160246*****
What schools did Tim Olson attend?
Tim Olson attended University Of North Dakota, Fergus Falls Community College.
What skills is Tim Olson known for?
Tim Olson has skills like Semiconductors, Electronics, Manufacturing, Semiconductor Industry, R&d, Product Development, Cross Functional Team Leadership, Engineering Management, Ic, Testing, Integration, Rf.
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