LQDX

LQDX formerly Averatek Corp., pioneers advanced materials for AI and high-performance computing applications, unlocking new possibilities for the semiconductor industry. Founded in collaboration with the Stanford Research Institute (SRI), the company, based in Silicon Valley California, has developed a suite of cutting-edge chemistries and process technologies to revolutionize chip interconnect architecture. As the demand for computing power skyrockets with the rapid rise of AI and ML computing, new tools are needed in the semiconductor packaging and Ultra High-Density Interconnect (UHDI) toolbox. At the heart of LQDX portfolio lies LMIx® - or Liquid Metal Ink® technology - a novel metallization chemistry suite that enables the production of circuits up to 250 times denser than conventional Printed Circuit Boards (PCBs) and the most advanced interconnects used as redistribution lines (RDLs) for chiplet integration and 3D die stacking using through-silicon-vias (TSVs) These advanced features, previously exclusive to silicon, are essential to meet the exponential growth demand in signal density required by advanced chips, chiplets and heterogeneous integration. As an alternative to highly expensive wafer processing which uses Physical Vapor Deposition (PVD) technology, LMIx® is a simple PVD-in-a-BottleTM substitute that integrates seamlessly into existing infrastructure.