Next Emballage

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Next Emballage Group was created in 2010 to give Picard Thermoforming, Air Forme and Petit Thermoforming a new dimension and thus allow the development of new technological solutions in the field of plastic packaging. The combination of these three industrial entities, created in the 70s, improves our performance by setting up synergies and improving employee cooperation. Next Packaging Group places its customer at the heart of its strategy and development. Our goal is to respond to a project in its entirety from the design of the packaging to the production line of our customers.

Company Details

Employees
14
Founded
-
Address
1, Rue Ampère, Zi De Nersac,france
Industry
Plastics Manufacturing
NAICS
Plastics Product Manufacturing
Plastics Packaging Materials and Unlaminated Film and Sheet Manufacturing
Plastics Pipe, Pipe Fitting, and Unlaminated Profile Shape Manufacturing
Laminated Plastics Plate, Sheet (except Packaging), and Shape Manufacturing
Polystyrene Foam Product Manufacturing
Urethane and Other Foam Product (except Polystyrene) Manufacturing
Plastics Bottle Manufacturing
Other Plastics Product Manufacturing
Plastics Bag and Pouch Manufacturing
Unlaminated Plastics Film and Sheet (except Packaging) Manufacturing
Unlaminated Plastics Profile Shape Manufacturing
Plastics Pipe and Pipe Fitting Manufacturing
Plastics Plumbing Fixture Manufacturing
All Other Plastics Product Manufacturing
HQ
NERSAC, Nouvelle-Aquitaine
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News

3M participates in JOINT3, a next-generation semiconductor packaging consortium - PR Newswire

3M participates in JOINT3, a next-generation semiconductor packaging consortium PR Newswire

Corn Next advances sustainable packaging with biodegradable Corn-17 and new U.S. facility - World Bio Market Insights

Corn Next advances sustainable packaging with biodegradable Corn-17 and new U.S. facility World Bio Market Insights

Thermal Challenges and Cooling Strategies for Next-Gen 3D Semiconductor Packaging - IDTechEx

Thermal Challenges and Cooling Strategies for Next-Gen 3D Semiconductor Packaging IDTechEx

Packaging M&A may not rise until next year, analysts say - Packaging Dive

Packaging M&A may not rise until next year, analysts say Packaging Dive

TSMC’s Next Major Milestone in the US Would Be The Opening of a New Advanced Packaging Facility By 2029, Coming One Step Closer Towards an Independent Supply Chain - Wccftech

TSMC’s Next Major Milestone in the US Would Be The Opening of a New Advanced Packaging Facility By 2029, Coming One Step Closer Towards an Independent Supply Chain Wccftech

What’s Next In Advanced Packaging? - Semiconductor Engineering

What’s Next In Advanced Packaging? Semiconductor Engineering

A multilayered approach: what's next for carton packaging? - Financial Times

A multilayered approach: what's next for carton packaging? Financial Times

Japan's Resonac sets up consortium on next-gen chip packaging tech - Nikkei Asia

Japan's Resonac sets up consortium on next-gen chip packaging tech Nikkei Asia

Belgium to tighten cigars and cigarillos packaging rules from next year - The Brussels Times

Belgium to tighten cigars and cigarillos packaging rules from next year The Brussels Times

Global Connected Packaging Trends: What's Next in 2024? - Little Black Book | LBBOnline

Global Connected Packaging Trends: What's Next in 2024? Little Black Book | LBBOnline

Generative AI: The packaging and paper industry’s next frontier - McKinsey & Company

Generative AI: The packaging and paper industry’s next frontier McKinsey & Company

Sustainability alert: Perrier announces winners of Next Packaging Movement - Recycling Today

Sustainability alert: Perrier announces winners of Next Packaging Movement Recycling Today

Advanced Semiconductor Packaging: Driving Next-Gen HPC Performance - IDTechEx

Advanced Semiconductor Packaging: Driving Next-Gen HPC Performance IDTechEx

Fungi could be the next eco-friendly packaging - societyforscience.org

Fungi could be the next eco-friendly packaging societyforscience.org

TSMC moves closer to next-gen packaging for Nvidia, Google AI chips - Nikkei Asia

TSMC moves closer to next-gen packaging for Nvidia, Google AI chips Nikkei Asia

Next-Generation Packaging Brings Reliability and Visibility to Supply Chains - Supply Chain Brain

Next-Generation Packaging Brings Reliability and Visibility to Supply Chains Supply Chain Brain

Egg cartons are the next packaging to be replaced by reusable containers - Fast Company

Egg cartons are the next packaging to be replaced by reusable containers Fast Company

Reaching the next normal in packaging - McKinsey & Company

Reaching the next normal in packaging McKinsey & Company

Beyond COVID-19: The next normal for packaging design - McKinsey & Company

Beyond COVID-19: The next normal for packaging design McKinsey & Company

Shaping the next normal of packaging beyond COVID-19 - McKinsey & Company

Shaping the next normal of packaging beyond COVID-19 McKinsey & Company

Is hemp the next revolution for sustainable packaging? Startup element6 Dynamics thinks so. - Packaging Dive

Is hemp the next revolution for sustainable packaging? Startup element6 Dynamics thinks so. Packaging Dive

The Next Generation of Sustainable Food Packaging to Preserve Our Environment in a Circular Economy Context - Frontiers

The Next Generation of Sustainable Food Packaging to Preserve Our Environment in a Circular Economy Context Frontiers

Ardagh Metal Packaging: What's Next For This 11% Yielding Stock (NYSE:AMBP) - Seeking Alpha

Ardagh Metal Packaging: What's Next For This 11% Yielding Stock (NYSE:AMBP) Seeking Alpha

The Next Normal – The future of packaging: Smart bottles, edible boxes - McKinsey & Company

The Next Normal – The future of packaging: Smart bottles, edible boxes McKinsey & Company

Next-Gen 3D Chip/Packaging Race Begins - Semiconductor Engineering

Next-Gen 3D Chip/Packaging Race Begins Semiconductor Engineering

LEGO plans to get rid of single-use plastic packaging starting next year - Designboom

LEGO plans to get rid of single-use plastic packaging starting next year Designboom

5 Keys to Next-Generation IC Packaging Design - EE Times Europe

5 Keys to Next-Generation IC Packaging Design EE Times Europe

Smart Labels: The Next Big Thing in IoT and Packaging - Packaging Strategies

Smart Labels: The Next Big Thing in IoT and Packaging Packaging Strategies

Is algae plastic the next big thing in packaging? - PlasticsToday

Is algae plastic the next big thing in packaging? PlasticsToday

Is packaging for the elderly the next untapped market? - FoodNavigator.com

Is packaging for the elderly the next untapped market? FoodNavigator.com

Canada sets sights on next plastic waste target: food packaging - Global News

Canada sets sights on next plastic waste target: food packaging Global News

Australia's packaging regulatory reform: What's next? - PKN Packaging News

Australia's packaging regulatory reform: What's next? PKN Packaging News

Cradle-to-cradle: the next packaging paradigm? - Packaging World

Cradle-to-cradle: the next packaging paradigm? Packaging World

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