PERFORMANCE INTERCONNECT

PERFORMANCE INTERCONNECT offers advanced electrical interconnect solutions employing a proprietary non-destructive, solderless interface technology superior in performance and cost to conventional connection methods. The S-FECT™ technology is a zero-insertion force contact interface which can be applied between connectors and PCBs or between mating connectors and it is suitable to make direct connections PCB to PCB. S-FECT™ contact diameters are from 0.20mm to 3.50mm and are able to carry up to 50 Amps continuous per contact. Performance Interconnect will design a superior solution for any high-speed or power interconnect application and will select the most effective and competent manufacturing solution resulting in the best performance to price option for the customer. Performance Interconnect offers advanced thermal interconnection systems for embedded computing applications where conduction cooling is employed. The HEATBIND™ patent pending technology is the world's most effective thermal interconnection for embedded computing applications. HEATBIND™ is significantly superior to wedgelocks, ICE-LOKS or any other open or patented retainer technology. HEATBIND™ is suitable for Open VPX, Space VPX, Open SOSA, Compact PCI Serial and Compact PCI Serial Space applications. We also produce custom designs employing the HEATBIND™ technology and we produce thermal test and custom chassis in 3U and 6U formats. Performance Interconnect offers PCB design and PCB manufacturing services flex or rigid, up to 50 layers, employing the most advanced materials and state-of the art production facilities. Performance Interconnect offers CNC and machining services employing state of the art machinery with tolerances down to 0.01mm and expertise to process aluminum alloys, copper alloys, titanium and tungsten carbide. Performance Interconnect is your reliable design partner with quick turnover capabilities for both design and manufacturing.