PROUD

Innovation and optimized processes lead to lower production costs which have considerably increased access to electronic products and digital technology to even broader audience. The general benefit is an increase in the use of digital services, electronics devices, and interconnected equipment for the good of all of us. Nevertheless, in its hyper-connected way of living we can no longer ignore the environmental impact of the technology we are using to make that possible. One of the main problems is chip overheating leading to performance losses, then chip failures, and finally a pile of electronic waste that is difficult to recycle and contains toxic components that have a detrimental impact on our environment. Our EPFL-patented technology, based on unique diamond implementation solutions, increases the energy efficiency, performance, compactness, and reliability of power electronic devices. Today PROUD offers a new starting material for power electronics: a wafer based on an integrated layer of high-quality diamond and one (or more) semiconductor layer(s). Thus, the chipmaker can obtain an immediate improvement in heat dissipation thanks to the exceptional heat dissipation capacity of diamond (15 times greater than silicon) while maintaining its usual substrate and avoiding any modification within its production line. Subsequently, our high-quality diamond layer will also help the chip user to develop a new generation of components thanks to its unparalleled ability to withstand high voltage (60 times better than silicon), work at higher temperature (up to 500°C compared to 180°C for silicon) and its ability to work at higher frequencies. Finally, PROUD aim to limit the energy consumption, preserve our natural resources, and reduce CO2 emissions.