PTW SpinTec GmbH

SpinTec's experts, the early core team of SEZ, collaborated due to the needs of developing new process applications required by the Semiconductor Industry for existing SEZ tools in the field. As a result a production line for 150mm to 300mm single wafer wet etch equipment was established to upgrade or replace systems in the field with new developed process applications. KEY APPLICATIONS: SIC, Si, GaAs... substrate processing Thin wafer processing (warped wafer) Particle, polymer and residue removal Backside/bevel cleaning Silicon substrate thinning/stress relief APPLICATION RANGE: Substrate, Film, Metal-Etch Surface, Post CMP-, Pre EPI Clean Bevel Etch & Clean Backside Film Removal GLOBAL SUPPORT - RELATIONSHIP RELIABILITY