QXP Technologies

About QXP Technologies Founded in 2014 by a team of industry veterans, QXP Technologies is a leader in the research, development, and manufacturing of Photonic Integrated Chips (PICs) and related devices, modules, and subsystems. Operating under an Integrated Device Manufacturer (IDM) model with strategic partner fab, QXP is also constructing a wholly-owned fabrication facility (FAB), set for completion by the end of 2025. Our Breakthrough Material Platform QXP has developed a unique, low-loss silicon-based material platform, offering an exceptional balance between SiO₂ and Si material technologies, and exceeding the performance of SiN. With ultra-low loss (<0.1 dB/cm) and high refractive index contrast (1%–25%), our platform enables large-scale photonic integration with superior performance. Powering the Future of AI Data Centers Leveraging our proprietary material platform, QXP delivers cutting-edge solutions for next-generation AI infrastructure: ✔ Best-in-Class Mux/Demux PICs & Devices – Enabling 200G–1.6T high-speed transceivers (mass-produced, shipping millions annually to global customers). ✔ 800G/1.6T Silicon Photonics Optical Engine (Under Development) ✔ Silicon Photonics-Based 1×N & N×N Optical Circuit Switches (OCS) (Under Development) ✔ External Cavity Lasers (ECL) for Long-Reach Coherent Transceivers (Under Development) Beyond Data Centers: Emerging Applications QXP also provides custom PIC solutions for: ✔FMCW LiDAR (featuring high-density splitters, micro-mirrors, PBS, etc.) ✔Quantum Key Distribution (QKD) ✔Biosensing ✔PIC Gyros, and other advanced PIC applications. With innovation at our core, QXP Technologies is shaping the future of photonics integrated circuits - enabling faster, more efficient, and scalable optical solutions for the AI era and beyond.