RUSALOX Overview
- Headquarters
- Moscow, Ru
- Phone Number
- Available in AeroLeads
- Website
- rusalox.ru
- Industry
- Nanotechnology Research
- Employees
- 3
- Founded
- 2011
- Company Email
- Available in AeroLeads
- NAICS
-
Research and Development in Nanotechnology
Keywords
Thermal Management
High Thermal Conductivity PCB 120W/m*K
Substrates for COB and flip chip technologies
Substrates for power modules (IPMs
MOSFETs
IGBTs)
Double-side substrates with metallized vias
Substrates for UV curing
PCBs for power electronics
Substrates for IF and laser applications
Dielectric strength up to 4000 V ВС
About RUSALOX
RUSALOX is a high-tech developer and manufacturer of high thermal conductive PCB and substrates. Manufacturing process is based on unique aluminum oxide (al oxide) technology, which provides high cooling efficiency of any heat-dissipating electronic components. RUSALOX al oxide PCB and substrates have performance comparable to standard ceramics (Al2O3/AlN) with mechanical features of IMS (Insulated metal substrate) materials at a very competitive price to the alternatives. Considering characteristics of multi-functional electronics products, various electronic components shalle be mounted on a single substrate. Recently, a heat dissipating problem caused by heat generating elements mounted on the substrate has been an issue. The unique heat-radiating substrate including an insulating layer formed on a metal core layer and a circuit layer formed on the insulating layer have been commercialized and patented up to now by RUSALOX LLC. The heat-radiating substrate has excellent heat-radiating property as compared to a general organic PCB; moreover, it is possible to implement high density/integration of the heat-radiating substrate. In addition, when heat generating elements such as LED and electronic components vulnerable to heat are simultaneously mounted on a single substrate, the al oxide heat-radiating substrate has high integral thermal conductivity (120 W/mK), such that heat generated from the heat generating elements is transferred to the entire heat-radiating substrate (in particular, through a metal core layer) and is also transferred to an area where heat is not transferred, thereby degrading the performance of the thermally weakened elements. Applications - General LED lighting - WireBond Chip-On-Board (COB) - Chip-On-Board - Flip Chip - Horticultural LED Lighting - Automobile LED lighting - Power Electronics - Power modules (substrates for IPMs, MOSFETs, IGBT) - High-frequency Industry More information is published on our website http://rusalox.ru/en/product-category/pcbs/
RUSALOX Contact Details
- People in AeroLeads
- 3
RUSALOX Org Chart
Sample employees and titles| Name | Title | Location | Contact |
|---|---|---|---|
| Olga Tokareva | Associate Director of Overseas Operations at Rusalox | Russia, Russian Federation |
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|
| Elena Moiseenko | Rusalox | Moscow, Moscow City, Russia, Russian Federation |
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| Elena Rybakova | Office Manager – Llc Rusalox | Russia, Russian Federation |
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Employees by Management Level
Director
1 profile
Manager
1 profile
Individual contributor
1 profile
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