Heyan Technology Co., Ltd.

Heyan Technology specializing in diamond dicing saw, wafer grinders, and related peripheral equipment. Heyan relies on nearly 40 years experience on R&D and the manufacturer of : - Precision dicing saw (wafer saw, package saw, jig saw machines, wafer ring cut machine, wafer edge trimming machine, precision half cut machine, DBG process dicing machine, etc.. ) - Wafer grinder : 4~12 inches manual and automatic back grinder - Semiconductor back-end equipment, consumables - Consumables for wafer dicing , high precision jigs& toolings - Process counsulting, and supply chain management For wide applications in the semiconductor industries. Until year 2022, The company has delivered more than 4500+ dicing saws to more than 600+ clients worldwide. The company has 400+ employees, with a strong R & D teams of 150+ engineers as well as 100+ service team, self-owned 23000m² standard production plant (2 more plant in future to build), set up in Suzhou R & D service center, 9 domestic service centers, and 2 authorized agents in overseas markets. Heyan is committed to providing customers with a full range of dicing & grinding services such as R&D, sales, consulting. Our Core competiveness: 1. Full dicing application coverage: More than 15+ models 2. Fast lead time: 20~45 days machine delivery 3. More than 100+ after sales engineer 24/7 onsite service 4. Machine can be customized, all software functions optional 5. Lab support for dicing new product 6. Client dicing process development / optimization 7. Dicing OEM services 8. Customized back-end Pkg solutions