TECNISCO was established in 1970 as a processing service provider for precision components, taking advantage of DISCO Corporation's cutting and grinding technologies. Since then, we have developed and integrated our technology fields into a "Cross-edge" technology which crosses five leading-edge technologies such as Cutting, Grinding, Polishing, Metalizing, and Bonding.
In particular, our processing (technology) are using at the following fields.
- Structured glass wafers for MEMS packaging
- Glass micro fluidic for Drug discovery and Chemical reaction
- Customized heatsinks for Laser Diode and LED
We support your design and manufacturing with our Cross-edge technologies.
Company Details
- Employees
- 14
- Founded
- -
- Address
- 2-2-15, Minami-Shinagawa, Shinagawa-Ku,tokyo 140-0004,japan
- Industry
- Semiconductors
- Website
- tecnisco.co.jp
- Keywords
- Structured glass wafers for MEMS packaging, Glass micro fulidic for Drug discovery and Chemical reaction, Customized heatsinks for Laser Diode and LED, MEMS, Heatsink, Diamond, Thermal management, Laser, Spacer glass.
- HQ
- Shinagawa-ku, Tokyo
Tecnisco, Ltd. Questions
Tecnisco, Ltd.'s website is tecnisco.co.jp
Tecnisco, Ltd.'s LinkedIn profile is https://jp.linkedin.com/company/tecnisco-ltd
Tecnisco, Ltd. has
14 employees.
View email and phone details for 14
employees at Tecnisco, Ltd..
Tecnisco, Ltd.'s industry is
Semiconductors
Tecnisco, Ltd.'s top competitors are
Imobiliárias Golden,
Shenzhen Merry Precise Electronic Co.,ltd,
Ase Electronics (M) Sdn Bhd,
Advanced Micro Foundry,
Semi Sea,
Planet Pharma,
Maruwa Co., Ltd.,
Comercial Mundo Transfer Limitada,
Klv Co.,ltd.,
Amd.
Tecnisco, Ltd.'s categories are Semiconductors
Tecnisco, Ltd.'s founding year is 1970
