U-BOND TECHNOLOGY

Dongguan U-Bond Material Technology Co., Ltd. (hereinafter referred to as “U-Bond Technology”) was established on September 26, 2003 with a registered capital of 60 million yuan. The company is headquartered in Dongguan City, Guangdong Province, with product development centers and manufacturing bases in South China and East China. The company has a professional customer service team and a sound sales network. It has offices in Yantai, Hefei, Chongqing, Wuhan, Xiamen and Southeast Asia, and subsidiaries in Taiwan, Hong Kong and the United States. The company's products are diversified and are committed to providing customers with systematic product solutions. The main products are adhesives, electronic soldering materials, cleaning agents, material surface treatment agents, photoelectric chemicals, semiconductor special chemicals, automation equipment, environmental protection, etc., mainly for 3C, solar photovoltaic, power supply, LED and lighting, home appliances, automobiles Other industries provide specialized materials and solutions.