Winbond

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Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services. Winbond's product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets. Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China, Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.

Company Details

Employees
1.47K
Founded
-
Address
No. 8, Keya 1st Rd.,daya Dist.,, Taichung City,428,taiwan, Province Of China
Phone
886425218168
Industry
Semiconductor Manufacturing
NAICS
Semiconductor and Other Electronic Component Manufacturing
HQ
Taichung City
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News

Winbond Introduces the New Automotive-qualified W77T Secure Flash Memory - PR Newswire

Winbond Introduces the New Automotive-qualified W77T Secure Flash Memory PR Newswire

Winbond enhances LPDDR4/4X DRAM products for automotive applications - New Electronics

Winbond enhances LPDDR4/4X DRAM products for automotive applications New Electronics

Winbond Unveils 1Gb QspiNAND for Wearable and Low-Power IoT Devices - Embedded Computing Design

Winbond Unveils 1Gb QspiNAND for Wearable and Low-Power IoT Devices Embedded Computing Design

Winbond claims top spot in NOR flash market ... - eeNews Europe

Winbond claims top spot in NOR flash market ... eeNews Europe

Winbond’s new OctalNAND Flash provides fast, low-cost alternative to Octal NOR Flash in densities of 1Gbit and higher - EE Times Europe

Winbond’s new OctalNAND Flash provides fast, low-cost alternative to Octal NOR Flash in densities of 1Gbit and higher EE Times Europe

Winbond Introduces new Sequential Read Function in High-Speed QspiNAND Flash - TechPowerUp

Winbond Introduces new Sequential Read Function in High-Speed QspiNAND Flash TechPowerUp

Winbond extends performance of Serial NAND Flash Memory with new 1Gbit device offering maximum data-transfer rate of 83MB/s - embedded.com

Winbond extends performance of Serial NAND Flash Memory with new 1Gbit device offering maximum data-transfer rate of 83MB/s embedded.com

New ASIL-D certificate boost safety and security credentials of Winbond's W75F Secure Memory Element - digitimes

New ASIL-D certificate boost safety and security credentials of Winbond's W75F Secure Memory Element digitimes

Winbond has unveiled its latest 1Gb QspiNAND for Wearable and Low-Power IoT Devices - PR Newswire

Winbond has unveiled its latest 1Gb QspiNAND for Wearable and Low-Power IoT Devices PR Newswire

New ASIL-D Certificate Boost Safety and Security Credentials of Winbond?s W75F Secure Memory Element - Embedded Computing Design

New ASIL-D Certificate Boost Safety and Security Credentials of Winbond?s W75F Secure Memory Element Embedded Computing Design

Next generation 8Mb Serial Flash for small IoT devices ... - eeNews Europe

Next generation 8Mb Serial Flash for small IoT devices ... eeNews Europe

Winbond introduces CUBE architecture for Edge AI devices - New Electronics

Winbond introduces CUBE architecture for Edge AI devices New Electronics

Safeguarding boot code and other critical data: how little-known data protection settings in NOR Flash can help improve system reliability - embedded.com

Safeguarding boot code and other critical data: how little-known data protection settings in NOR Flash can help improve system reliability embedded.com

Winbond Unveils New 1.8V 512Mb SPI NOR flash for 5G and Other High-End Server Applications - PR Newswire

Winbond Unveils New 1.8V 512Mb SPI NOR flash for 5G and Other High-End Server Applications PR Newswire

Winbond ranked as top global NOR Flash supplier ... - eeNews Europe

Winbond ranked as top global NOR Flash supplier ... eeNews Europe

Winbond joins UCIe Consortium to support chiplet interface standardisation - New Electronics

Winbond joins UCIe Consortium to support chiplet interface standardisation New Electronics

Efinix Selects Winbond HyperRAM™ for its Ti60 F100 Platform to Drive a New Generation of Compact, Ultra-Low Power AI and IoT Devices - PR Newswire

Efinix Selects Winbond HyperRAM™ for its Ti60 F100 Platform to Drive a New Generation of Compact, Ultra-Low Power AI and IoT Devices PR Newswire

100pin LPDDR4/4X memory package achieves JEDEC standard ... - eeNews Europe

100pin LPDDR4/4X memory package achieves JEDEC standard ... eeNews Europe

Winbond launches HyperRAM WLCSP package - New Electronics

Winbond launches HyperRAM WLCSP package New Electronics

Flash memory and the demands of the automotive functional safety ... - eeNews Europe

Flash memory and the demands of the automotive functional safety ... eeNews Europe

Kneron KL720 SoC uses a 1Gb LPDDR3 DRAM die from Winbond - New Electronics

Kneron KL720 SoC uses a 1Gb LPDDR3 DRAM die from Winbond New Electronics

Sustainable electronics - New Electronics

Sustainable electronics New Electronics

$6 Pine64 Ox64 SBC features BL808 64-bit/32-bit RISC-V multi-protocol WiSoC with 64MB RAM - CNX Software

$6 Pine64 Ox64 SBC features BL808 64-bit/32-bit RISC-V multi-protocol WiSoC with 64MB RAM CNX Software

All you need to know about the leaked Valve VR headset: is Half-Life 3/2 coming? - The Ghost Howls

All you need to know about the leaked Valve VR headset: is Half-Life 3/2 coming? The Ghost Howls

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