WLP 4 OPTO

WLP 4 OPTO researched and developed a glass wafer processing technology that has been continually refined through ongoing studies on materials and processes research. Our semiconductor manufacturing process handles glass and silicon wafers, delivering a wafer-level packaging solution for 6 and 8-inch wafers with 400 to 700 opto-packages per wafer. The optimal combination of technology, product, and market experts, together with our IP backed process, positions us to capitalize on a unique market opportunity.