 Acquire new customers and develop new business opportunities. Develop an understanding of customers’ needs and requirements and submit proposals and/or make presentations to meet those needs. Close sales. Business planning for area of responsibility. Report on sales, sales progress, and activity plans as well as customer opportunities and issues. Contribute to the growth and development of the company and the sales team.

 Lead / Coordinate and plan new device/package development activities Lead R&D NPI team during new package design technical risk in terms of design, process, materials and equipment feasibility.  Effectively interface with cross-functional teams (Production, Quality, Procurement and Design) to achieve the target set by the customer. Effectively communicate and update the customers on new product development timeline, build reports, reliability reports and daily/weekly reports.  Lead R&D NPI team to execute the different build stages from assembly to Test without delay in schedule. Resolve all engineering issue and customer concerns on every build stage prior mass production. Prepares project master plan to ensure all team are on the same page on all the project status. Provide coaching and technical assistant to the NPI engineering team to resolve internal and external technical issue. Work with operation, procurement and planner on the supply preparation for mass production stage. Prepares required such as FMEA, Control plan and other documents as required by customer. Accountable to achieve defined project results.

DPBU(FOL) – FACA Department Team Lead of process engineers supporting SMT, Chip Attach and Dispensing (Under fill, Side fill and Glob Top) process. Provide efficient and effective in-process investigation, defect and yield analysis, improvement action and process controls to prevent problem recurrence. Conducts initial failure analysis and process root cause analysis. Initiates and recommends corrective action based on technical analysis to maintain the specified quality, yield, and productivity levels. Guide the team in new material, process, and equipment validation. Review process documentations such as process specification, OCAP, control plan, PFMEA and other process related documents. Leads the simulations of probable root causes to identify true root causes, performs process mapping as needed. Leads the team of process engineers in attaining yield goals through yield improvement activities. Own special project that will result in process, yield improvement.

 Manage and Lead team of Process engineers supporting Die attach, Wire bond, Casting, Mold, Dumbar cut and forming process. Lead yield improvement activities to achieve yield target for product handled. Lead and facilitates cross functional team (manufacturing, maintenance, quality) to achieve quality and on time delivery. Develops and provides effective and efficient manufacturing methodologies/procedures, materials, engineering projects and design that will ensure products highest quality, yield, and reliability. Leads the simulations of probable root causes to identify true root causes, performs process mapping as needed. Guides the team to work on a complete 8D for internal or external customer defects related to visual/mechanical requirements, packaging quality, and correct processing. Investigates causes of hold lot issues and internal or external customer complaints and gives disposition, containment actions, and preventive actions to affected lots. Review and approve process documentations including lot processing procedure, Assembly instructions, OCAP, Control Plan and PFMEA and other related documents.

Fan-out Wafer Level Package (FOWLP) Lead and own process and equipment development activities of chip attach process for panelization process of FOWLP package. Developing the process flow and technology. Developing process, operations, and equipment specifications for the new process. Developing of OCAP, FMEA and the likes for the new process Support qualification of builds for new customer devices. Early identification of critical issues with the macro modules or new tools

 Lead and support NPI and development activities for new customers’ new product introductions. Review new product/package conformance to design rule and perform risk assessment for design rule non-conformance. Initiate and drive process, equipment and yield improvement projects and productivity program. Define and characterize new processes and material as well as process parameter optimization. Reviews manufacturing specifications and initiates modifications and changes to achieve quality, yield productivity / manufacturing goals. Perform process and equipment evaluation through data collection, analysis, statistical experiments that will result in improved yield and quality. Conducts initial failure analysis and process root cause analysis. Initiates and recommends corrective action based on technical analysis to maintain the specified quality, yield and productivity levels. Generates reports on various activities including evaluation of new products, evaluation of new processes and improvements of processes for existing and new products. Formulation and review of FMEA, Control Plans, OCAP, Assembly Instruction and Baseline Specification. Acts as mentor to newly hired engineer. Performs orientation and training on related module.

Technology: SCSP/Flash Technology  Lead and supervise group of technicians to sustain process and equipment matrices. Drive process, equipment and yield improvement projects and equipment productivity program. Develop white papers for any changes and improvement necessary for the module. Formulation of process and equipment FMEA, Control Plans and other documents of its kind. Develop equipment-training plan and conduct equipment and process training to improve technical competency of technicians and operators. Sustain and improve equipment performance equal or better than the defined indicators through productivity programs. Implement preventive maintenance, calibration, and spares management program. Interface with vendor on technical matters such as equipment problems, improvement, design, and software upgrade. Develop PO spec as guidelines for the purchase of new equipment for my module. Provide efficient and effective in-process investigation, defect and yield analysis, improvement action and process controls to prevent problem recurrence.

 Initiate and drive process, equipment and yield improvement projects and equipment productivity program. Reviews process specifications and initiates modifications and changes to further achieve quality, yield productivity / manufacturing goals. Generates reports on various activities including evaluation of new products, evaluation of new processes and improvements of processes for existing and new products. Formulation and review of FMEA, Control Plans, OCAP.

 Support and handle NPI activities of assigned customers by monitoring closely front-of-line to end-of-line assembly of customer builds, engineering, and qualification lots. Ensures strict enforcement and implementation of required specification and defined requirements to avoid failure or customer feedback. Reviews manufacturing specifications and initiates modifications and changes to achieve quality, yield productivity / manufacturing goals. Implements technical manufacturing process that will provide to a particular customer needs and specifications to ensure finished products meet the prescribed standards. Conducts initial failure analysis and process root cause analysis. Initiates and recommends corrective action based on technical analysis to maintain the specified quality, yield and productivity levels. Ensures adherence to customer standards and recommends actions to contain and correct quality problems. Generates reports on various activities including evaluation of new products, evaluation of new processes and improvements of processes for new products. Define and characterize new processes and material as well as process parameter optimization. Document and orientation of new material on existing process and new process on existing material.  Formulation and review of FMEA, Control Plans, OCAP.

Site Assignment: Intel Technology Penang Sdn. Bhd (01 June 2000 to 30 October 2002)Technology: Flip Chip Technology Development Malaysia (ATDM)Site Assignment: Intel Technology Philippines, Inc. (01 November 2002 to 16 March 2005)Technology: Flash TechnologyModule: Flip chip Attach Module / Die Attach ModuleDuties and Responsibilities Acts as a Module Integrator for the start-up activities. Support new product start-up of Intel Penang and Intel Pudong site for new chipset product. Owns and drives the Design of Experiments (DOE) necessary for the module. Interface with vendor on technical matters such as equipment problems, improvement, design, and software upgrade. Drive process, equipment and yield improvement projects and equipment productivity program. Develop white papers for any changes and improvement necessary for the module. Formulation of process and equipment FMEA, Control Plans and other documents of its kind. Owns the planning until completion of the projects and production readiness identified by the module. Develop equipment-training plan and conduct equipment and process training to improve technical competency of technicians and operators. Improve equipment maintenance costs through cost reduction programs. Own and update documentation such as specifications, characterization reports and spare parts list. Implement process and equipment transfer and ensure that equipment passes safety certification. Perform process and equipment evaluation through data collection, analysis, statistical experiments that will result to yield, process and quality improvement. Actively participate in Virtual factory meetings, task force and contribute through shared learning. Support new product start-up through flawless execution, development of Best-Known Methods and Optimization of machine parameter and performance Supports technology transfer from development site to the receiving sites at different Intel sites.

 Supervise and manage groups of process and maintenance technicians that support the process. Sustain and improve equipment performance equal or better than the defined indicators through productivity programs. Implement preventive maintenance, calibration and spares management program. Interface with vendor on technical matters such as equipment problem, improvement, design, and software upgrade. Drive process, equipment and yield improvement projects and equipment productivity program. Improve equipment maintenance cost through cost reduction program. Own and update documentation such as specifications, characterization reports and spare parts list. Implement process and equipment transfer and ensure that equipment passes safety certification. Perform process and equipment evaluation by data collection, analysis, statistical experiments that will result in yield and quality improvement. Ensure safe working condition for operators and technicians by implementing safety programs and maintains 5S. Actively participate in Virtual factory meetings, task force and contribute through shared learning. Support new product start-up through flawless execution, development of Best-Known Methods and optimization of machine parameters and performance.

 SMT Core Group Leader that formulates process and quality improvement projects. Revision and documentation of manufacturing process specification machine parameters, in conformance to customer requirements. Plan, design and develop the most effective procedures in the assembly of components and products. Initiate process evaluation to attain optimum parameter that will result to yield and quality improvements. Work hand in hand with the New Product Group during transition mode for new devices. Perform immediate analysis and disposition on any line problems encountered daily. Perform regular analysis of First Pass Yield and initiate relevant corrective actions on low yield data. Design Jigs and Fixtures that will improve process and manufacturability. Conduct training to production operators for every new product introduction, implementation of new procedures and parameters. Spearhead formulation of quality improvement programs Lead start-up of new products at SMT line and evaluate results. Machine Handled a. SMT Pick and Place Machine- Yamaha Pick and Place Machineb. Reflow Oven- Heller Reflow Ovenc. Solder Dispense/Printing Machine- DEK 249 Solder Dispensed. Encapsulation Machine- Asymtek Encap Dispensing Machine

 Perform set-up and conversion on all the SMT machines used in the production area. Perform preventive maintenance on all SMT machines according to their schedule. Perform calibration and make corrective actions on equipment and tooling found to have discrepancies. Promote and perform proper housekeeping and always maintain safe working conditions. Maintain an accurate record of machine and equipment history, spare parts and supplies inventory. Design, fabricate and install worthwhile projects to improve process and yield. Installation and qualification on new machines for a new process.Machine Handled a. SMT Chip Placer Machine- FUJI FCP IV-3 - NITTO STM-Y- FUJI FCP II - TDK RX-5B - FUJI FEP 20b. Reflow Oven- Vitronics 700/300- Vitronics Unitherm 500c. Solder Dispense/Printing Machine- DEK 249 Solder Dispensed. Wave Soldering Machine- EPM CIG 400 wave solder- EPM CDD 300 wave solder- EPM HD 327 wave solder

 Management of people by enforcing discipline and teamwork in their work. Conduct training for operators to improve their knowledge with respect to their work and to keep them up to date on the new process.  Production planning and development of methods to decrease production downtime and increase production efficiency. Maintain high standard quality of printed fabric through continuous improvement programs.  Maintain on time customer delivery and prepare daily and monthly production reports.