Lead and manage a talented team of RF/Microwave, Mechanical, Digital, Software, and CAD Design Engineers. Direct the staff responsible for new product development and sustainment. Plan and develop strategies to increase the effectiveness and capability of the group with a focus on agile workflow, continuous improvement, and talent development. Plan resources and budgets to achieve annual product release goals. Collaborate with Operations staff to ensure design manufacturability (in volume) and improve gross margin of released products.

Functionally manage a diverse team of RF/Microwave hardware design engineers while retaining technical leadership responsibility for numerous micro/millimeter-wave designs. Provide leadership in a fast-paced environment executing multiple projects to support development and production programs, as well as, new business pursuits. Administrative responsibilities include employee engagement, performance management, career development, employee reward and recognition, and conflict resolution. Prioritize the team’s individual responsibilities and tasks to align with project schedules and overall business objectives. - Emphasize open and active communication to leverage the shared knowledge and experience of the team. - Highlight design re-use and best practices to minimize time-to-market and eliminate design defects. - Mentor and motivate employees through coaching and formal performance reviews to develop skills and retain talent. - Work to grow organizational talent through strategic hiring.- Ensure compliance with company policies and rules as well as the AS9100 standard.The Principal Engineer technical leadership role involves designing multi-chip, multi-channel assemblies and SiP systems from DC to 40GHz+ for commercial, military, and space applications. Responsibilities include building positive relationships with customers, identifying suitable system architectures, performing system trades, developing design specifications from customer interactions, and supporting proposal efforts. Proposal support includes providing technical, cost, and schedule estimates. The role also demands hands-on testing of micro/millimeter-wave components, cards, modules, and systems in addition to providing technical support to manufacturing/production.

Led the development of numerous aerospace and defense products used within naval, airborne, missile, and space platforms. Responsible for systems level analysis, specification interpretation/negotiation, detailed system and circuit level modeling, DVT/ATP test, and handoff to production. Analysis includes frequency conversion planning, cascade and statistical yield analysis, temperature compensation planning, and signal chain design for low spurious, low phase noise, IP3, gain, and noise figure (among other key metrics). Generated complex 3D EM simulations including multilayer PCBs and high power thermoelectric models (HFSS + Ansys Mechanical). Proven track record interacting with and presenting to customers and senior management. Routinely interface with customers, PM, Manufacturing, ME, and functional management through all phases of product research, design, and production.-Developed a millimeter wave multi-channel, low noise, high incident power receiver used for critical defense applications. The small form factor design incorporates a patented low-loss; high-power waveguide transition, PIN limiter switches, and a custom LNA.-Engaged in the development of an ultra-wideband (L to Ka-Band) satellite SiP RX/TX module. The mixed signal design incorporates a RF and ADC/DAC component lineup within a LGA package intended for LEO/GEO space environments. Key performance metric is a minimum 45dB NPR with 2.5GHz instantaneous bandwidth.-Led the development of a 2-18GHz; 200W RF power amplifier for EW systems. Delivered the final product on-time with an aggressive design and delivery schedule.-Worked as part of a team to develop two high power RF amplifier modules. HMC8113 and HMC8114 are 500/90 Watt RF power amplifiers 2-6 and 6-18GHz respectively.

Responsible for the design and test of RF, microwave, and millimeter wave space qualified communication systems and hardware products. Specialize in extremely high frequency V/W-Band and E-Band (50-110 GHz) solid state power amplifiers, frequency converters, and low noise amplifiers. - Designed multiple space based E-Band (60-90 GHz) beacon and transponder payload architectures; derived system specifications, developed system link budgets, completed cost and technical trade studies, identified risks, and completed hardware demonstrations for customers. - Led the design of hermetic E-Band GaN and GaAs solid state power amplifiers (SSPA), low noise amplifiers (LNA), and frequency converters. - Supported LM Business Development organizations by contributing to technical proposals and cost estimates.

Employed microwave principles and practices to develop link budgets, design filters, complete cascade analyses, create temperature compensation and impedance match circuits. Built and simulated 2D and 3D electromagnetic models and circuit layouts. Coordinated design team tasks with program management, mechanical engineering, quality, manufacturing, and supply chain. Collaborated with parts and equipment vendors to acquire quotes, convey requirements, and remain cognizant of new products. Directed the procurement of $3M in material and equipment since 2008.