- Responsible of North America Customer Quality for Electronics and Semiconductors Business Units. Leading Regional CQ team.- Global CQ Leader for Semiconductors Business Unit. Supporting integration of new sites.

Responsible of Quality System and team. Leading Zero-Defects program.Leading corrective actions for internal issues and customer complaintsLeading risk analyses for New Products Development and providing support to ensure manufacturing capability while meeting Customer Specifications. - Reduced customer complaints by 60% at Molding/Brush-Cap Manufacturing plant (Dec 15)- Automated system for Skids Identification- Developed training material for QA people. Certified 100% of QA people at Blow Molding Manufacturing plant.- Developed programs (using cameras) to reduce by 75% the time to measure the external dimensions of molded bottles.

Responsible for Supplier’s quality (imported product). Developing Nonconformance Reports for suppliers, following up until closure.Responsible for customer quality returns. Supporting customers and ensuring corrective actions for main issues.- Defined internal metrics.- Reduced by 50% the time for developing Artwork & Packaging Nonconformance Reports.- Documented process flow and procedures.

Responsible for managing and improving Quality System (ISO/TS 16949, AS 9100) for Anode/Wire Mfg and EOL MnO2 plants. Leading quality team, ensuring alignment to business unit objectives. Assigning priorities, providing support and resources. 17 leaders/engineers/technicians reporting, ~100 hourly people.*Interim Process Engineering Superintendent- Leaded team to get TS certification for Wire Mfg plant.- Leaded Business Unit team to develop Quality Roadmap for FY13. - Leaded team to reduce EOL complaints by 50% from Q3 to Q4FY13.- Reactivated QOD201 Methodology (Process control and continuous improvement).- Upgraded FMEAs, Layered Audits and Maverick Lot detection systems.- Developed and applied ‘The right people’ initiative at Quality team.

Leaded CQE team. Defined activities and assigned priorities to provide timely and effective responses to customers. Provided support and resources, as necessary. Ensured accurate and timely failure analyses to the external customers as well as the plant of manufacture. Supported the teams to provide accurate and timely corrective actions to customers (using G8D methodology). Follow up on internal metrics to provide feedback to manufacturing plants and management.For manufacturing root causes, coordinated/supported the communication between the manufacturing plant and the customers. For customer application related root causes, communicated/coordinated all troubleshooting and improvement activities required to achieve customer satisfaction.Coordinated customer visits to manufacturing plants.Support regional Customer Quality Engineering Groups (Asia and Europe).

Leaded team to redesign R products and process to improve yield from 50% to 70%. Anode design and process development, Process control improvement (on equipments).New R part types development (design/process). Leaded team to improve A685/016 yield from 70% to 85% using Six Sigma Methodology. Total annual savings of $48K USD.Involved in the team to develop/update FMEAs for Racking, Formation and Dual Formation Areas. Higher RPN at Dual Formation (exceeded time) was reduced from 350 to 105.Signed off Green Belt Six Sigma projects for Products Yield improvement at ECP/Testing areas.