Alex Matson Email & Phone Number

Goleta, Ca

-Process Development for IR Sensor Wafer Level Packaging--Design and process optimization, supply chain interface, production process tracking, extreme troubleshooting, reliability and vacuum life testing, and F/A.-Also have extensive experience in Process Development and Design for hermetic IR vacuum packaging--Team Leader on effort that established high volume, automated vacuum packaging line for uncooled IR sensors for automotive applications. Included design and process optimization for low cost, high volume packaging.

-Laser diode hermetic package design, development and testing(solder, adhesives, laser weld, wirebond, seam seal, leak testing)-TEC design, specification and testing-Reliability testing (Halt, Hast) for Telcordia compliance-Tunable wavelength locker design and development-Extensive failure analysis activities

-Air Handling System for AAAV ECU System-Condensate Storage Tank for SPACEHAB Double Module-Potable Water Pump System for Boeing Commercial Aircraft-Various other fluid delivery, cooling and purification systems

-Infrared Dewar Packaging Design and Processes-Bearing Development for Satellite Scan Mirrors-Laser Diode Packaging for Medical Application

-Powertrain Engineering (Cooling and Aftercooling System Design/Analysis/Test, High Temp/Max Load Performance Testing)-Vehicle Subsystem Design and Integration-Armor System Design, Development and Test

Ms, Mechanical Engineering

Bsme/Bsecon, Me And Business