My experience includes SI/PI, HW, DSP, SW and mechanical teams supervising and technical leading in the different projects such as: medical, entertainment, mobile, automotive and network. My previous positions cover the systems requirements definition, specification and guidelines preparation, analysis methodologies and flow creation for measurements, simulation and estimations.If you are looking for the Signal and Power Integrity Expert, System Technical Leader or High Experience HW digital and analog board designer you can arrange a meeting and examine my experience and knowledge according to your position requirements. I believe that my multidisciplinary experience, wide knowledge, high and deep learn ability and problems root understanding can contribute to your company and move forward projects and company experience.Professional Skills:Signal and Power Integrity: Power Deliver Network and High-Speed Interfaces Simulations, Extractions, De-embedding, Analysis, Methodologies and Flow Definition; Simulation Results Correlation to Measurements by VNA and Micro-probing; PCB and Package Layout Recommendations and Design Guidelines/Application Notes Preparation for PDNs and Signals; Participation in SoCs IOs Specification/Parameters Definition and SoC Power Analysis; IBIS AMI and IOs Behavioral Models Generation: CTLE, DFE, De-emphasis and etc. Participation in M-PHY MIPI Standard Definition, High-Speed Interfaces Analysis and Simulation Environment Creation:• Aurora 10Gbps, Ethernet 56G/112G, PCIe 2/3/4/5, LPDDR-DDR2/3/4/5, M-PHY, UFS-2/3, SATA-2/3, JESD204B/C, TM667/800/1200, HS533/600System: Specification Definition and Writing: System Functionality – Whole Product as well as for Power, Clocking, FPGA and CPU Blocks, Interfaces, Throughput, Noises, Cost and Robustness Definition and Calculation.Analog and Digital Board Design: Full Board Design Cycles Implementation and Supervising: Board Specification Writing from the Requirements in Conjunction with System, Mechanical, FPGA and Algorithm Teams, Component Selection, Schematic Creation, Prototype Development and Components’ EVBs Evaluation, PCB Materials and Stack-up Definition, Pre-layout and Post-Layout Digital and Analog Simulations – Crosstalk, Noises, Reflections, ISI, Bandwidth and Losses, PCB Layout Recommendations and Design Guidelines Preparation, Cooperation with Layout Design Houses and PCB Manufacturers, Bring-up and PCBs Parameters Validation According to the Specification, ATP and ICT Definition and Document Preparation, Verilog Hardware Synthesis for PCB’s Bring-up and ATP.