Andrew Ho Email & Phone Number

Singapore

Neubiberg, München, De

• Managed ASE Group, the largest OSAT supplier account, with an annual spend of $320 million, including the integration of Infineon, Cypress, and International Rectifier’s Subcon businesses.• Devised and developed a Strategic Roadmap targeting $800 million spend by 2028.• Employed game theory negotiation strategies to achieve 6-21% savings, amounting to $9.8 million in savings in 2023 (to date).• Negotiated and delivered $22.9 million in savings for Infineon in 2022 through tactical and strategic negotiations.• Drove the 2022 capacity supply security through the negotiation of loading agreements and forecast commitments.• Administered cost increases driven by suppliers due to rising material/labor costs while securing critical capacities for 2022 & 2023.• Created a reconciliation framework to mitigate loading agreements’ penalty clause.• Structured and presented targets and execution plans to secure 2022 Subcon capacities to BE President and Division COOs.• Developed a sourcing strategy for new pre-assembly plasma dicing technology for silicon microphone manufacturing, resulting in $10 million in negotiated savings over 5 years for a $25 million purchase volume order in 2020.

Neubiberg, München, De

• Awarded the Infineon Procurement Quarterly Gold Award for exceptional negotiation skills, achieving $180 million in final negotiated savings on the next-generation Time-of-Flight project with a Foundry supplier.• Acknowledged as a key figure in Infineon's Foundries outsourcing activities, overseeing annual purchases totaling $600 million.• Set performance benchmarks as the lead negotiator, securing a strategic TSMC wafer supply frame agreement valued at $2 billion.• Closed critical Frame/Wafer Supply Agreements with key suppliers, including TSMC, Samsung, UMC, Tower, Globalfoundries, Newport, and UTAC, ensuring supply security over a 10-year horizon.• Handled contracts and commercial negotiations with suppliers, covering mask, wafer fabrications, wafer test, and preassembly pricing, contributing to high trajectory growth.• Orchestrated board-level strategic outsourcing projects, involving the development of strategic partnerships, supplier selection, and make-or-buy decisions for power discrete outsourcing.

Neubiberg, München, De

• Established a pioneering Procurement Supplier Management group in Singapore.• Served as a functional specialist, leading overall supplier management with a focus on NPI/operation and quality management.• Collaboratively engaged in the joint development of 40nm embedded flash technology with Globalfoundries.• Successfully negotiated regular price reductions ranging from 5% to 43%, resulting in estimated annual cost savings of $400,000.• Led efforts to deploy Supplier Enabling 2.0 processes for Infineon Global and extended them to all front-end suppliers.• Implemented a meticulous and structured approach, leveraging both engineering and commercial expertise to execute front-end and back-end semiconductor work.

Neubiberg, München, De

• Produced and co-produced 18 technical papers focused on wafer fabrication, and process development, including photolithography and plasma etch, showcasing a strong commitment to technical excellence.• Coordinated with stakeholders to define equipment roadmaps for Fab1 & Fab2, contributing to strategic planning/alignment.• Identified and managed 38 unit process projects, encompassing technology transfers and new process developments, while working closely with production teams to swiftly resolve complex challenges.• Distilled complex technical issues and disseminated pertinent information within a large international engineering team, facilitating the successful completion of transfer projects.• Established a new organizational structure, charter, procedures, and expectations to cultivate an enabling work culture.

Neubiberg, München, De

• Achieved exemplary results, securing 2 prestigious ToQ Infineon Silver Awards for significant improvements in metal etch corrosion and blocked etch processes, garnering recognition from the CEO.• Recognized for outstanding performance with the Top Engineering Manager Award in 2012.• Received the Top Engineering Manager YIP (Your Idea Pays) Award in both 2011 and 2012.• Realized annual cost savings of €750,000+ in FY 2011 through yield improvements and equipment enhancements implementation.• Successfully orchestrated the first joint collaboration in Southeast Asia with Galiso Inc., USA.• Reported to the Director and led a team of 10 senior/staff engineers.

Munich, ., De

Technology Transfer from Dresden to US/Taiwan sites.• Acted as a crucial bridge between R&D and transfer sites for the 65nm buried word line technology transfer, effectively resolving transfer issues from Dresden to ensure optimal results in 2008.• Partnered with R&D process and equipment engineers, contributing expertise to discussions on 46nm/65nm technology topics.• Integrated and streamlined new procedures and systems for technology transfer, fostering collaboration with counterparts from the USA, Singapore, and Taiwan.• Successfully identified and provided solutions for technology-related issues.

• Credited for establishing a new metrology department at TECH Semiconductor in 2007, including the formulation of new policies and recruitment efforts to align with the organizational philosophy and business needs.• Played a pivotal role in unprecedented R&D efforts, achieving a groundbreaking world-first 300mm conversion on the fly with record-yielding wafers within just 1.5 months of wafer starts in 2006 while maintaining 200mm wafer outputs.• Directed 95nm technology start-up, attaining tier-2 qualifications in 4.5 months by adopting a copy-exact philosophy and efficient process release procedures. This achievement was recognized as the most successful device start-up in Micron's history in 2004.• Appointed to represent TECH Semiconductor within the Micron R&D team in Boise, USA, contributing to the development of the next-generation 95nm DRAM technology node in 2003.

Advanced Litho applications and characterizations

Executive Master Of Business Administration - Emba

Master Of Engineering, Mems, Micro-Electro-Mechanical Systems

Bachelor Of Engineering (Beng), Mechanical Engineering