Angelo Mendoza Email and Phone Number

> Performed in-depth board-, module-, package-, and die-level failure analysis on various products (i.e., mixed-signal devices, power management devices, references, display drivers, fan controllers, etc.) using advanced techniques and state-of-the-art tools and equipment on customer returns, manufacturing, test engineering, and reliability failures. The analysis is done through electrical characterization/verification, fault isolation, physical analysis, defect characterization, and root-cause/corrective action. When the failure mechanism is identified, all necessary failure information is documented, and useful feedback is provided to the end customer. Issuance of corrective action requests and 8D reports are necessary to improve internal systems and processes.> Directly communicate with ADI’s Worldwide Design, Product, Application, and Quality groups for the resolution of both customer and internal issues> Collaborated with cross-functional teams for failure verification/validation, test setup, and characterization> Proficient in semiconductor fabrication, test, assembly & packaging processes> Developed and implemented new failure analysis techniques and procedures to improve analysis efficiency and accuracy> Trained and mentored junior engineers and technicians in failure analysis techniques and procedures> Developed and maintained failure analysis documentation, including test procedures, reports, and data analysis tools

> Works with an R&D team for the development of Integrated Circuits.> Makes an initial study, estimates the schedule of an assigned job, and completes tasks in a given time duration.> Reverse engineered numerous ICs from top semiconductor companies. This is through physically mapping analog and digital cells and translate them to schematics using Cadence Virtuoso. And simulate the schematic to ensure a working circuit.> Analyzed and retarget different reverse-engineered building block design