Anish Shenai Email & Phone Number

Milpitas, California, Us

Milpitas, California, Us

Chandler, Az, Us

Multi-Chip Module (MCM)/System in Package New Product Development - Technical Project Lead- Leading three-die and dual-die MultiChip New Product Development teams (size > 50 engineers) across two different Business Units and four countries for the first time in history of Business Unit.- Engineered package and bonding diagram to include maximum peripherals while minimizing loss of functionality to customers.- Streamlined package manufacturing process to improve manufacturing while working with an external assembly subcontractor in Asia.- Delivered engineering samples to internal customers, early adopter samples to external customers to validate product through continuous feedback.- Developed and constantly tracking New Product Schedule using Critical Chain Project Management (MS Project, Gantt Charts, Prochain/Ceptah bridge tools and JIRA) and communicating real-time status updates to project stakeholders and management- Successfully navigating through chip shortage to ensure production lines are kept running for external customers while continuing new product development through collaboration with Marketing and Production Planning.

Chandler, Az, Us

16-Bit extreme Low Power Microcontroller with USB in low count packages - Chip Lead- Lead NPD project from conception to completion in 21 months (Fastest in BU) on base revision A0 (1st in technology node).- Facilitated Q100 Grade 1 device qualification status by designing hardware, debugging qualification failures, supporting assembly, monitoring test flows and results, and individual qualification steps of Early Life Failure Rate, High Temperature Operating Life, ESD and Latch-up Testing.- Characterized datasheet limits to establish lowest current consumption specifications amongst PIC24 devices, remain competitive in market while having a final test package yield of >99%.- Navigated through covid-19 restrictions across 5 countries to deliver test hardware and samples for internal and external customers.- Maintained Project dashboard and schedule while regularly communicating with stakeholders, upper management on project progress.- Resolved silicon issues through debugging, ATE testing, JIRA parser reviews and errata publication.- Presented at New Product Review Board and Change Control Board to highlight mid-project course deviations to stakeholders.

Chandler, Az, Us

- Analyzed Probe Yield, Final Yield, and Lot Rejection Ratio for 11 masks to ensure that none of the devices fell below target and took immediate corrective actions if needed.- Closed out ~10+ Non-Standard Customer Action Requests with data analysis, test flow development, and feasibility studies.- Conducted ~30+ Manufacturing Quality Review Checklist Meetings at various milestones- Lead 4 sustaining projects (metal/All-Layer revisions) to correct high priority errata and improve manufacturability.

In

Master Of Science In Engineering (M.S.E), Electrical Engineering

Bachelor Of Engineering (B.E.), Electrical, Electronics And Communications Engineering