Sr. Product Line Manager
Current• Business portfolio P/L analysis, cost/pricing/market strategic analysis, risk management for laminated PCB products • Managing projects/products contributing >25% revenue to ACS organization with healthy market & margin growth• Keywords: high-speed/high-frequency PCB, PTFE/woven glass lamination, IC substrate, IC module, dielectric materials, Cu foil profile, surface roughness, peel strength, specialty materials, multi-layer lamination, PCB fabrication, chemical elements, filtration, purification, material properties, insertion loss, cleanroom