Joining as the start up team for new advanced packaging manufacturing plant, particularly in charged in wafer sort.

• Join as startup team and involved directly in process and equipment qualification prior to SOP.• Responsible for new equipment (die sorter integrated with build in AOI) buy-off and closed deal process• Acquired good knowledge on most of the fundamental engineering tools – SPC, FMEA, DOE, 8D report, MSA• Involved in SECS/GEM and CBM setup for die sort equipment.• Involved in “paperless inside production line” project and successfully managed to implement on own process completely. • Auditee (process owner) for all OSRAM customer (especially automotive customer) as to qualify for IATF 16949 chip sale.• SAP software expert user for equipment maintenance side.• Lead a cost reduction project on process yield variance. Analyzation is focused on technical and non-technical (direct) yield loss.

Engineering Fluid Mechanics design and application of better alternative of spider vein and vericose vein treatment using lower energy level foam based method, achieving better chemical homogeneity thus more effective treatment