Asif Pathan Email & Phone Number

With 4+ years of engineering expertise in Signal integrity, Power integrity and PCB design domain, I am highly skilled in SI, PI and PCB design for high speed packagesand boards of leading semiconductor product companies.Signal and Power Integrity (Package and board level) Worked on time and frequency-domain extractions, analysis and characterization using industry standard full 3D field solver tools. Performed simulations on multiple high speed serial and parallel interfaces such as DDR3/3L, LPDDR4, PCIE3/4, Ethernet, USB3/3.1 Troubleshooting multiple high speed interfaces accounting for crosstalk, Reflections, Jitter and other frequency domain phenomenon using signal and power integrity concepts.  Package and board Power integrity analysis like DC drop, Current density, VIA current and Power plane impedance analysis. Implemented corrective measures to optimize PCB power distribution networks. Knowledge on IBIS, IBIS-AMI modelling and expertise on SIPI cosimulations. Worked on transient simulation on package level using HSpice and power aware simulations on parallel interface (LPDDR4).PCB Design engineer Designed Multilayer Printed Circuit Boards and performed PI simulations. Developing multilayer PCB’s with high speed Interfaces from schematic to Design. Good experience in schematic capture, Library development, Constraints setting, PCB routing, Gerber generation etc. Excellent exposure in Cadence (OrCAD/Allegro)