•4+ years of hands-on experience of design/manufacturing/processing/defect monitoring of advanced semiconductors.•Skilled and knowledgeable in metal/ composites manufacturing/ processing/ testing/ characterization.•Adept at collaborating with the research team to ensure optimal turnaround and experimental efficiency with analytical and problem-solving skills.•Strong technical writing, communication, and presentation skills demonstrated by presentations in conferences and publications in 7 top tier peer-reviewed journals.• Characterization/MetrologyScanning Electron Microscopy (SEM), Transmission Electron Microscopy (TEM), Complex Impedance analysis, Focused Ion Beam (FIB), X-Ray Diffraction (XRD), X-ray Photoelectron Spectroscopy (XPS), RamanImaging, Electromagnetic absorption/interference measurement with VNA, Thermogravimetricanalysis (TGA), 3-point bend test, Failure Analysis, Microscopy, Metallography• LaboratoryHigh-temperature sintering (Up to 2000°C), Powder processing, Polymeric precursor handlingand processing, Spin coating, CNC machining, Hot and Cold pressing, CMC manufacturing,Aluminum alloy casting, Vacuum for High-temperature system, PLCs, PID control systems.• SoftwarePython, PLCs, MATLAB, LATEX, Solidworks, Origin, Nanohub, ZView, ImageJ, Microsoft Office Tools,CasaXPS, LabVIEW.
Listed skills include Microsoft Excel, Microsoft Word, Leadership, Microsoft Office, and 13 others.