Experienced professional with a demonstrated history of working in semiconductor advanced packaging, assembly materials, power electronics and hard disk media industry. Proven record in product management and development, market segment, process improvement and project management, with success in implementing initiatives resulting in higher levels of efficiency. Possesses strong leadership, communication and interpersonal skills, with the ability to influence, coach and build strong relationships with key stakeholders to ensure project successCORE COMPETENCIES• Experienced in product lifecycle management for semiconductor packages and assembly materials • Strong knowledge on semiconductor packaging platforms - Panel-level packaging, wafer-level packaging, SiP, Fan-Out WLP, WLCSP, TSV, flip chip, 2.5D, 3D chip stack, mini and microLED• Proven track record of successfully identifying and pursuing business opportunities, establishing strategic partnerships, and achieving sales targets• Extensive experience on semiconductor backend and re-distributed layer (RDL) processes - Die attach, lamination, laser drilling, PVD, photolithography, electroplating, solder mask passivation, encapsulation, Ag-sintering, wire-bond, fine-pitch soldering, SMT• Excellent track record on new product innovation and design• Experienced in customer engagement to establish market needs and Voice of the Customer (VoC)• Experienced in new production line setup and product ramp-up qualification• Well versed in semiconductor product standards and reliability test methodology e.g., IPC/JEDEC, AECQ-100