Benson Liu Email and Phone Number
Benson Liu work email
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Benson Liu personal email
+15 years semiconductor package experience. New Product Introduction/Technical program manager working with Division/Product development team to transfer new products/technology/processes (NPI/NTI) and governing the operations preparing for high volume production ramping readiness, familiar with semiconductor packaging process/technology (especially solder, Epoxy underfill process, substrate interaction etc) with excellent problem solving skills, managing NPI/NTI transferring/operations. Working with cross-functional/oversea groups to meet all milestones with big pictures without lost in all the details and balanced all short-term needs, drive technical issue resolution at early stage. Understand FMEA, statistical process control (SPC), DOE etc with JMP/excel hands-on skills. Oversea working experiences in Intel Vietnam and exposed to biz travels in Malaysia, US etc. I am quite exciting while facing challenges and always focus on solution providing and learner rather than problem complainer ๐
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Head Of RndAmq Intelligent TechnologyChengdu, Sichuan, China
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Director Of EngineeringBiwin Technology Aug 2024 - Present
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Module Process EngineerApple Jun 2023 - Mar 2024Chengdu, Sichuan, ChinaHardware technology -
Npi Program/Product ManagerIntel Products(Chengdu) Corporation Jan 2020 - Jun 2023Chengdu, Sichuan, ChinaResponse for specific product transfer from US development and Division to high volume factories, work with all functional group including but not limited to Assembly, Test, Quality, Planning, GSM, Manufacturing etc to ensure readiness meet all milestones and quality requirements. Plan/manage the capacity for all kinds of engineering builds and work through different functional groups to resolve all technical problems.
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Npi/Technical Project ManagerIntel Prosucts(Vietnam) Corporation Dec 2016 - Dec 2019Ho Chi Minh City, VietnamOversee Assembly process and lead/coach on tough technical issue resolution. Managing particular segment products transfer team from Assembly process.
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Senior Project Manager & Assembly Technology/Process IntegratorIntel Corporation Jun 2010 - Dec 2016Chengdu, Sichuan, ChinaManaging new product/technology transfer from development team to high volume manufacturing site, governing an transferring team to ensure it's meet DFM goal and readiness for ramping without issue. As Assembly expert, led tough technical issues investigation, demonstrated excellent problem solving skills. -
Process Equipment EngineerIntel Corporation Jul 2005 - Jun 2010Chengdu, Sichuan, ChinaInstall and qualify new Epoxy Underfill links, transfer new products from development site or other oversea factories and integrated into underfill HVM process. Responsible for process healthy monitoring and issues/excursions investigation, CA/PA, baseline improvement in product life cycle. Arrange daily manufacturing activities for own module and coordinating with other stakeholders.
Benson Liu Skills
Benson Liu Education Details
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Chemical Engineering
Frequently Asked Questions about Benson Liu
What company does Benson Liu work for?
Benson Liu works for Amq Intelligent Technology
What is Benson Liu's role at the current company?
Benson Liu's current role is Head of RnD.
What is Benson Liu's email address?
Benson Liu's email address is be****@****tel.com
What schools did Benson Liu attend?
Benson Liu attended Tianjin University.
What are some of Benson Liu's interests?
Benson Liu has interest in Children, Economic Empowerment, Civil Rights And Social Action, Education, Science And Technology, Arts And Culture.
What skills is Benson Liu known for?
Benson Liu has skills like Statistical Process Control, Semiconductors, Project Management, Electronics, Program Management, Lean Manufacturing, Cross Functional Team Leadership, Manufacturing, Design Of Experiments, Engineering.
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