HIGHLIGHTS:Over 18 years industry experience in semiconductor equipment (electroplating and surface prep equipment)Lead Process Engineer for ASM-NEXX P500 panel level plating tool (Cu, Ni, Sn, Au)Work closely with panel customers to align hardware with process requirementsLead Process Development Engineer on NEXX plating Tools (P300 and S300)Lead development engineer on NEXX compact plating cell with ion exchange membranes (SnAg and Cu)Provided Process Support that resulted in tool acceptance for more than 100 tools at over 30 customer sites with Semitool, IncWorked closely with Sales, Factory, and Service teams to provide seamless process support to customers Effectively managed time and resources to provide process support to all of the Semitool Equipment installed on the east coast of the U.SSpecialties: Wet Surface Cleaning (Single Wafer & Batch)Electroplating (Copper, Gold, Solder, Nickel, Tin, Tin-Silver)TSV Start-up ExperienceExpert in Troubleshooting complex Process Issues12+ Years Field Process Experience6+ Years of development experience at NEXX application lab (P300 and P500 tools)