Boon Yee Ee Email & Phone Number

Bayan Lepas, My

Penang, Malaysia

Kulim, Kedah, Malaysia

Kulim Microprocessor and Chipset Operation, Kulim, Kedah, Malaysia.Position: Manufacturing Principal Engineer 2017-2024Responsibilities:• Led the Virtual Factory Assembly Predictive Maintenance team, enabling IoT sensor technology and equipment failure detection to improve equipment performance. • Managed Intel Kulim Factory Equipment & Operations to ensure predictable performance, optimizing productivity, downtime, and yield. • Served as the Virtual Factory NPI technical problem solver, addressing equipment and process technology gaps. • Led the Virtual Factory Assembly Collateral/Tooling Sustaining Working Group to standardize handling, storage, and maintenance procedures, reducing material-related issuesAchievements:● Developed Intel’s Smart Manufacturing IoT 4.0 infrastructure, enabling predictive signals for over 100 tools and saving approximately $5 million by minimizing product scrap.● Established a tactical and strategic framework for the HPM/Module Equipment/Collateral Working Group, achieving best-in-class assembly/test performance in USDT, MTBA, and quality metrics for four consecutive years.● Achieved best in class Thermal bonding module performance in term productivity, Yield & quality by resolving 70% bond head performance issue that result non wet & Massive Merge bump issue through equipment input & output fingerprinting matching methodology. Proliferated across assembly module operation ex Lid attach, Ball Attach, Interposer & etc.● Led the VF CPU Server product Task Force to address high warpage and flux printing inconsistencies, reducing defects from 0.15% and helping lower ATNS interposer flux stain defects from 1% to 0.2% through innovative equipment and process improvements.● Deployed the VF Assembly Module Engineering Collateral Management Sustaining Process, enhancing storage management and handling procedures to eliminate damage-related issues.

Kulim

Kulim Microprocessor and Chipset Operation, Kulim, Kedah Malaysia Position: Senior Assembly/backend Engineering and HPM Manager 2010-2016Responsibilities:● Managed the Ball Attach/Interpose Attach & Backend Engineering team to enhance manufacturing performance in equipment OEE, yield, quality, cost, and technology transfer.● Led the Assembly Module Operation High Precision Maintenance team to optimize OEE, reduce PM time, and implement predictive maintenance signals for world-class equipment performance.Achievements:● Successfully led a new module to meet factory delivery KPIs for production output, quality, and cost, addressing equipment ramp challenges and ensuring competency readiness across all levels through strategic planning.• Resolve major packaging technology that related high warpage packaging ball placement issue through A Patent Publication number: 20160181222 “Pick head For Solder Ball Placement on An Integrated Circuit Package”. ● Achieved world-class manufacturing indicators in tool availability, yield, quality, and productivity, fostering an 'Operation Excellence' culture that emphasizes teamwork between engineering and manufacturing.● Established an engineering career path matrix at the factory level to ensure skill competency and support future technology needs for the Malaysia site.● Initiated innovations for collateral cost reduction in worldwide factories, including hybrid templates and redesigned tooling, resulting in millions of USD in savings for 2015.● Led the Virtual Factory Ball Attach Reflow and Metrology Process Matching Task Force, achieving zero solder joint reliability customer excursions related to BA and reflow profiles.

Intel Corporation

Assembly Test Technology Development Malaysia, Penang, MalaysiaPosition: Assembly Packaging Technology Pathfinding & development Sr engineer 2006-2009 Responsibilities:● Led pathfinding and development efforts to assess new package design rules, enhancing assembly equipment technology capabilities and identifying cost-saving opportunities.● Conducted pathfinding for Ball Attach fine pitch 0.3/0.4mm BGA attach equipment and processes for ultra-small and thin packaging technology.Achievements:● Improved assembly processes and package design for cost efficiency, process robustness, and new technology integration, including epoxy underfill KOZ reduction and smaller ball pitch packages.● Engaged in pathfinding for 0.3/0.4mm fine pitch packaging, assessing ball attach process options and reliability performance.● Achieved the first-ever placement of 12mil balls on a 0.5mm ball pitch using a single pass to place over 30,000 balls on a highly warped strip substrate.● Developed and certified various packaging technologies, including flip chip BGA and Flip Chip Molded BGA, while enabling various flux/paste materials.● Created a new post-placement vibration process, resolving placement capability issues and extending tool capabilities with innovative, cost-effective solutions.

Advance Electrical And Electronics Engineering Systems, Credit

Electrical & Electronic Engineering, Applied Mechanic, Advanced Electrical Technology, Upper Second Class