Brian Wang

Brian Wang Email and Phone Number

Sales Director @ Phononic Inc | Driving APAC Revenue Growth @ Phononic Inc
durham, north carolina, united states
Brian Wang's Location
Taipei, Taipei City, Taiwan, Taiwan, Province of China
About Brian Wang

At Phononic Inc, leadership in the Asia Pacific Sales division is my current focus, where I am recognized for establishing and steering Sales/FAE teams towards unparalleled customer support and technical excellence. Tackling the unique challenges of the APAC market, our team collaborates with cross-functional groups to ensure customer success.With a foundation in Field Application Engineering, my expertise spans thermoelectric cooling applications and distributor management. Skills in finite element analysis and computational fluid dynamics, honed over years of practical application, play a pivotal role in my strategic approach to business development across diverse APAC cultures, including Japan, Korea, Singapore, Taiwan, and China.

Brian Wang's Current Company Details
Phononic Inc

Phononic Inc

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Sales Director @ Phononic Inc | Driving APAC Revenue Growth
durham, north carolina, united states
Website:
phononic.com
Employees:
86
Brian Wang Work Experience Details
  • Phononic Inc
    Director Of Asia Pacific Sales
    Phononic Inc Dec 2023 - Present
    Taipei City, Taiwan
    • Established and leading Sales/FAE teams for enhanced customer and technical support including 400G/800G/1.6T and DWDM, Tunable, Coherent EML laser temperature control and cooling• Experience in TEC (Thermo-Electric Cooler) integration for transceiver module in AI datacenter• Identified and suggested solutions for APAC challenges on company’s operation• Working with cross-functional teams (engineering/manufacturing/operational teams) to achieve customer success• Cross-cultural awareness and experience in APAC region; Japan/Korea/Singapore/Taiwan/China• Experience in business development and distributor management• Reporting to VP and GM
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  • Phononic Inc
    Field Application Engineer
    Phononic Inc May 2018 - Jan 2024
    Taipei City, Taiwan
    • Collaborated on global sales revenue growth for 19 consecutive quarters since 2018.• Delivered technical support and troubleshooting for thermoelectric cooler - EML Laser Cooling.• Designed application-specific TECs for Opto-Electronics applications, including 400G DR/LR4, 800G DR8, and 1.6T transceiver modules for AI datacenter segment.• SFP+, QSFP, OSFP form factor package experience• 1577nm 10GPON, 25/50GPON, NGPON2 package experience for wireless and FTTx• Provided guidance for failure analysis.
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  • Ability Enterprise Co.,Ltd.
    Sr. Engineer (Team Lead)
    Ability Enterprise Co.,Ltd. Dec 2016 - May 2018
    New Taipei City, Taiwan
    - Thermal team leader with 4 engineers- PCBA placement experience with thermal management - Experience with solving IP camera, 360 degree camera, and sports camera thermal issue- Experiment validation for simulation accuracy improvement - Computational fluid dynamics (CFD) knowledge- Knowledge with power consumption determination for components - Familiar with Icepak and Flotherm
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  • Grand Tool Precision
    Production/Manufacturing Manager(Co-Founder)
    Grand Tool Precision Apr 2016 - Dec 2016
    Kaohsiung City, Taiwan
    -Factory management for hot forging tool-Lead a 5-man team -Be responsible for production issue- Cooperate with suppliers to achieve delivery goal
  • Richtek
    Sr. Engineer
    Richtek Sep 2013 - Apr 2016
    Hsinchu County/City, Taiwan
    Developed inertia sensor(accelerometer and gyroscope) automation finite element analysis scriptsThe design concept and architecture were based on the simulation result.- Successfully delivered the first accelerometer in Richtek into MP stage- Developed the first FEM package offset modeling technique and procedure- Developed the first mechanical damping effect considering with air flow tunnel modeling technique using FEM, accuracy up to 90%- Developed the first chip level and package level shock modeling technique- Developed the first MEMS element frequency shift modeling technique under voltage loading
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  • Htc
    Engineer
    Htc Sep 2011 - Sep 2013
    -Mechanical test and finite element simulation (bending and drop) for LCD module, battery, plastic part, and metal part-Fundamental glass/plastic/metal/composite material mechanical property determination in static/dynamic test-Cushion material modeling and validation (foam & rubber, etc)-Adhesive material modeling and validation (OCA & double sided tape, etc)-Failure analysis for fracture & ductile material-Finite element analysis includes thermal, structural stress/strain, static/dynamic transient, impact stress/strain, and fracture-Non-linear modeling for simulation accuracy
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  • Roc Army
    Corporal
    Roc Army Oct 2010 - Aug 2011
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Brian Wang Education Details

Frequently Asked Questions about Brian Wang

What company does Brian Wang work for?

Brian Wang works for Phononic Inc

What is Brian Wang's role at the current company?

Brian Wang's current role is Sales Director @ Phononic Inc | Driving APAC Revenue Growth.

What schools did Brian Wang attend?

Brian Wang attended National Tsing Hua University, National Cheng Kung University.

Who are Brian Wang's colleagues?

Brian Wang's colleagues are Harsha Patel, Alecia Pettiford, Jesse Edwards, Saida Beradi, Wan Lin, Brooks Henderson, Mark Smitt.

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