Brian Wang Email & Phone Number

Taipei City, Taiwan

• Established and leading Sales/FAE teams for enhanced customer and technical support including 400G/800G/1.6T and DWDM, Tunable, Coherent EML laser temperature control and cooling• Experience in TEC (Thermo-Electric Cooler) integration for transceiver module in AI datacenter• Identified and suggested solutions for APAC challenges on company’s operation• Working with cross-functional teams (engineering/manufacturing/operational teams) to achieve customer success• Cross-cultural awareness and experience in APAC region; Japan/Korea/Singapore/Taiwan/China• Experience in business development and distributor management• Reporting to VP and GM

Taipei City, Taiwan

• Collaborated on global sales revenue growth for 19 consecutive quarters since 2018.• Delivered technical support and troubleshooting for thermoelectric cooler - EML Laser Cooling.• Designed application-specific TECs for Opto-Electronics applications, including 400G DR/LR4, 800G DR8, and 1.6T transceiver modules for AI datacenter segment.• SFP+, QSFP, OSFP form factor package experience• 1577nm 10GPON, 25/50GPON, NGPON2 package experience for wireless and FTTx• Provided guidance for failure analysis.

New Taipei City, Taiwan

- Thermal team leader with 4 engineers- PCBA placement experience with thermal management - Experience with solving IP camera, 360 degree camera, and sports camera thermal issue- Experiment validation for simulation accuracy improvement - Computational fluid dynamics (CFD) knowledge- Knowledge with power consumption determination for components - Familiar with Icepak and Flotherm

Kaohsiung City, Taiwan

-Factory management for hot forging tool-Lead a 5-man team -Be responsible for production issue- Cooperate with suppliers to achieve delivery goal

Hsinchu County/City, Taiwan

Developed inertia sensor(accelerometer and gyroscope) automation finite element analysis scriptsThe design concept and architecture were based on the simulation result.- Successfully delivered the first accelerometer in Richtek into MP stage- Developed the first FEM package offset modeling technique and procedure- Developed the first mechanical damping effect considering with air flow tunnel modeling technique using FEM, accuracy up to 90%- Developed the first chip level and package level shock modeling technique- Developed the first MEMS element frequency shift modeling technique under voltage loading

-Mechanical test and finite element simulation (bending and drop) for LCD module, battery, plastic part, and metal part-Fundamental glass/plastic/metal/composite material mechanical property determination in static/dynamic test-Cushion material modeling and validation (foam & rubber, etc)-Adhesive material modeling and validation (OCA & double sided tape, etc)-Failure analysis for fracture & ductile material-Finite element analysis includes thermal, structural stress/strain, static/dynamic transient, impact stress/strain, and fracture-Non-linear modeling for simulation accuracy

Master Of Science (Ms), Power Mechanical Engineering

Dissertation titled “Life Prediction of High Concentration Photovoltaic Module Subjected to Thermal Cycling Test”, 2010.

Bachelor Of Science (Bs), System And Naval Mechatronic Engineering