Brian Condie Email & Phone Number

United States

Lowell, Ma, Us

Austin, Texas, Us

Durham, North Carolina, Us

Durham, North Carolina, Us

Neubiberg, München, De

Cree (DBA Wolfspeed) purchased Infineon's RF Power division

Neubiberg, München, De

Austin, Texas, Us

Support & Development Failure Analysis ManagerCoordinate failure analysis activities of seven senior failure analysis engineering technicians and one principle reliability engineer.Daily and long term lab priority balance with respect to customer returns, yield enhancements, new product analyses, equipment maintenance as well as project work within lab.Communication with internal partners to meet or exceed customer failure analysis expectations.Responsible for lab budget.Evaluate new equipment that will improve lab capability or capacity.Continue former role of senior failure analysis engineer until business conditions improve

Austin, Texas, Us

Perform physical failure analyses & materials characterizations using analytical instruments.Perform failure analysis at wafer level, package level, substrate level, and die level. Generate failure analysis reports that are detailed, accurate, and concise with conclusions based upon physical results.Develop new package and device deprocessing techniques.Responsible for equipment installation, optimization and training.Provide recommendations to business groups, wafer fabs, assembly factories and R&D teams to facilitate permanent corrective actions.

Provide materials and process improvements for new product development and product sustaining for RF module & RF discrete transistors. Emphasis is placed on Si-LDMOS and GaAs-PHEMPT technologies.Business group liaison with off-shore final assembly factories and wafer fabs.Cost Reductions-Responsible for over $1-3 million year-on-year cost savings for over ten years through vendor negotiations, second sourcing & vendor yield enhancements.Manage competitor benchmark studies to identify industry critical success factors, measure gaps & incorporate best-in-class practices. Continuously monitor competitors, vendors and academic institution capabilities. Identify disruptive technologies and influence management with business and technology strategy proposals.Excelled in packaging, wafer fabricaton and assembly innovations to sustain Freescale's lead in radio frequency product portfolio. Champion high volume AuSn die attach process development to allow high power, high frequency Si & GaAs product portfolio development while ensuring high reliability standards. Designed and developed package housing high power amplifier module. 250 W output power at 2.1 GHz, 50 ohm input & output match, EMI shielding and best-in-industry thermal performance.

Bs, Materials Science And Engineering

Materials Science And Engineering