Brian Erwin

Brian Erwin Email and Phone Number

Engineer, Packaging Failure Analysis and Diagnostics @ IBM
Millbrook, NY, US
Brian Erwin's Location
Millbrook, New York, United States, United States
About Brian Erwin

My career is focused on creativity applying research, analysis, and engineering to solve complex materials challenges. I have the ability to: + perform comprehensive research, + search out new technologies & ideas, + fabricate test systems and methodologies, + troubleshoot & design complex processes, + make technical presentations, + write, edit, and review technical papers, and + manage projects.Specialties: Semiconductor fabrication, electronic packaging, spin-on-dielectric films, photolithography, excimer ablation lithography, rheology, glasses, colloidal glasses, polymers, & materials science.

Brian Erwin's Current Company Details
IBM

Ibm

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Engineer, Packaging Failure Analysis and Diagnostics
Millbrook, NY, US
Website:
ibm.com
Employees:
332208
Brian Erwin Work Experience Details
  • Ibm
    Engineer, Packaging Failure Analysis And Diagnostics
    Ibm
    Millbrook, Ny, Us
  • Ibm
    Engineer, Packaging Failure Analysis & Diagnostics
    Ibm Aug 2024 - Present
    Hopewell Junction, New York, United States
  • Ibm
    Manager, Microelectronic Quality & Reliability Engineering
    Ibm Aug 2022 - Aug 2024
    Poughkeepsie, New York, United States
  • Ibm
    Manager, Microelectronic Packaging Unit Process Development
    Ibm Jun 2015 - Aug 2022
    Hopewell Junction, Ny
  • Ibm
    Manager, Microelectronic Packaging Materials & Thermal Development
    Ibm May 2014 - Jun 2015
    Hopewell Junction, Ny
  • Ibm
    Engineer, Microelectronic Fbeol & Packaging Development
    Ibm Jan 2011 - May 2014
    Hopewell Junction, Ny
    Researched, developed, obtained, evaluated, and implemented new materials to improve current and new FBEOL and 3-D integration schemes. Advanced new processing tools and technologies to effectively personalize process materials. Developed new integration schemes to support existing and emerging applications goals.
  • Ibm
    Engineer, Microelectronic Packaging Development
    Ibm Jul 2005 - Dec 2010
    Hopewell Junction, Ny
    Utilized chemistry, polymers, and materials experience to increase yield, improve performance, and reduce cost of microelectronic products.• Developed high-throughput manufacturing processes for high-conductivity thermal interface (TIM) materials- tool specification, procurement, & qualification, and manufacturing process specifications (MPS).• Supported ceramic laminate manufacturing- binder solution optimization, support material handling, materials specifications (MES)… Show more Utilized chemistry, polymers, and materials experience to increase yield, improve performance, and reduce cost of microelectronic products.• Developed high-throughput manufacturing processes for high-conductivity thermal interface (TIM) materials- tool specification, procurement, & qualification, and manufacturing process specifications (MPS).• Supported ceramic laminate manufacturing- binder solution optimization, support material handling, materials specifications (MES) adjustment, green sheets casting, conductive paste shelf-life extension, and ultrasonic mask cleaning.• Aided in the identification, screening, and implementation of temporary TIM solutions for microelectronic test and burn-in.• Performed competitive analysis of novel organic packaging solutions. Show less
  • Espci
    Postdoctoral Researcher (Joint Appointment)
    Espci May 2008 - May 2009
    Paris Area, France
    • Critically reviewed experimental data and academic literature to develop new research projects and an improved understanding of the glassy dynamics of soft interpenetrable colloidal solutions.• Prepared new colloidal solutions and performed systematic rheological studies using a well defined research plan to illuminate the physics behind the ageing and shear melting of star glass solutions.• Rheological techniques included a combination of stress and strain controlled… Show more • Critically reviewed experimental data and academic literature to develop new research projects and an improved understanding of the glassy dynamics of soft interpenetrable colloidal solutions.• Prepared new colloidal solutions and performed systematic rheological studies using a well defined research plan to illuminate the physics behind the ageing and shear melting of star glass solutions.• Rheological techniques included a combination of stress and strain controlled experiments where samples were deformed in step, steady, and oscillatory conditions using techniques including large amplitude oscillatory shear (LAOS).• Co-authored eight peer reviewed publications which included aspects of this research. Show less
  • Foundation For Research And Technology - Hellas (Forth) Institute Of Electronic Structure & Laser
    Postdoctoral Researcher (Joint Appointment)
    Foundation For Research And Technology - Hellas (Forth) Institute Of Electronic Structure & Laser May 2008 - May 2009
    Greece
  • Ge Silicones
    Process Engineer
    Ge Silicones May 1999 - Dec 1999
    Waterford, Ny
    • Improved manufacturing up-time and stability working within cross-disciplinary teams optimizing silicone coloring processes.• Increased revenue by adjusting the product menu and outsourcing select lines after identifying low revenue product lines.• Reduced tool changeover expenses between product lines by adjusting manufacturing scheduling and training to impacted shifts.

Brian Erwin Skills

Materials Science Thin Films Semiconductors Design Of Experiments Process Engineering Nanotechnology Physics Characterization R&d Engineering Rheology Semiconductor Industry Polymer Chemistry Polymer Characterization Polymer Science Research Manufacturing Chemical Engineering Polymers Polymer Physics Computer Repair Semiconductor Manufacturing Semiconductor Equipment Semiconductor Design Colloids Research Design College Teaching University Teaching Teaching/mentoring

Brian Erwin Education Details

Frequently Asked Questions about Brian Erwin

What company does Brian Erwin work for?

Brian Erwin works for Ibm

What is Brian Erwin's role at the current company?

Brian Erwin's current role is Engineer, Packaging Failure Analysis and Diagnostics.

What is Brian Erwin's email address?

Brian Erwin's email address is th****@****hoo.com

What is Brian Erwin's direct phone number?

Brian Erwin's direct phone number is +184570*****

What schools did Brian Erwin attend?

Brian Erwin attended Penn State University, University Of Rhode Island, Penn State University.

What are some of Brian Erwin's interests?

Brian Erwin has interest in New Technology, Computers, Hiking, Materials, Rheology, Beer.

What skills is Brian Erwin known for?

Brian Erwin has skills like Materials Science, Thin Films, Semiconductors, Design Of Experiments, Process Engineering, Nanotechnology, Physics, Characterization, R&d, Engineering, Rheology, Semiconductor Industry.

Who are Brian Erwin's colleagues?

Brian Erwin's colleagues are Laura M Bruce, Bettina Kuppinger, Mohan H N, Karla Ayala, Kelly Lou Brodeth, Rukma Reddy, David M Greggs.

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