Brian Erwin
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Brian Erwin Email & Phone Number

Engineer, Packaging Failure Analysis and Diagnostics at IBM
Location: Millbrook, New York, United States 10 work roles 3 schools
2 work emails found @ibm.com 5 phones found area 845, 401, and 814 LinkedIn matched
✓ Verified Jul 2026 4 data sources Profile completeness 100%

Contact Signals · 2 work emails · 5 phones

Work email b****@ibm.com
Direct phone (845) ***-****
LinkedIn Profile matched
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Current company
IBM
Role
Engineer, Packaging Failure Analysis and Diagnostics
Location
Millbrook, New York, United States
Company size

Who is Brian Erwin? Overview

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Quick answer

Brian Erwin is listed as Engineer, Packaging Failure Analysis and Diagnostics at IBM, a with 332208 employees, based in Millbrook, New York, United States. AeroLeads shows a work email signal at ibm.com, phone signal with area code 845, 401, 814, and a matched LinkedIn profile for Brian Erwin.

Brian Erwin previously worked as Engineer, Packaging Failure Analysis & Diagnostics at Ibm and Manager, Microelectronic Quality & Reliability Engineering at Ibm. Brian Erwin holds Doctor Of Philosophy (Ph.D.), Materials Science from Penn State University.

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Email format at IBM

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{first_initial}{last}@ibm.com
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AeroLeads found 2 current-domain work email signals for Brian Erwin. Compare company email patterns before reaching out.

Profile bio

About Brian Erwin

My career is focused on creativity applying research, analysis, and engineering to solve complex materials challenges. I have the ability to: + perform comprehensive research, + search out new technologies & ideas, + fabricate test systems and methodologies, + troubleshoot & design complex processes, + make technical presentations, + write, edit, and review technical papers, and + manage projects.Specialties: Semiconductor fabrication, electronic packaging, spin-on-dielectric films, photolithography, excimer ablation lithography, rheology, glasses, colloidal glasses, polymers, & materials science.

Listed skills include Materials Science, Thin Films, Semiconductors, Design Of Experiments, and 25 others.

Current workplace

Brian Erwin's current company

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IBM
Ibm
Engineer, Packaging Failure Analysis and Diagnostics
Millbrook, NY, US
Website
Employees
332208
AeroLeads page
10 roles

Brian Erwin work experience

A career timeline built from the work history available for this profile.

Engineer, Packaging Failure Analysis And Diagnostics

Ibm

Millbrook, Ny, Us

Engineer, Packaging Failure Analysis & Diagnostics

Current
Ibm

Hopewell Junction, New York, United States

Aug 2024 - Present

Manager, Microelectronic Quality & Reliability Engineering

Ibm

Poughkeepsie, New York, United States

Aug 2022 - Aug 2024

Manager, Microelectronic Packaging Unit Process Development

Ibm

Hopewell Junction, Ny

Jun 2015 - Aug 2022

Manager, Microelectronic Packaging Materials & Thermal Development

Ibm

Hopewell Junction, Ny

May 2014 - Jun 2015

Engineer, Microelectronic Fbeol & Packaging Development

Ibm

Hopewell Junction, Ny

Researched, developed, obtained, evaluated, and implemented new materials to improve current and new FBEOL and 3-D integration schemes. Advanced new processing tools and technologies to effectively personalize process materials. Developed new integration schemes to support existing and emerging applications goals.

Jan 2011 - May 2014

Engineer, Microelectronic Packaging Development

Ibm

Hopewell Junction, Ny

Utilized chemistry, polymers, and materials experience to increase yield, improve performance, and reduce cost of microelectronic products.• Developed high-throughput manufacturing processes for high-conductivity thermal interface (TIM) materials- tool specification, procurement, & qualification, and manufacturing process specifications (MPS).• Supported ceramic laminate manufacturing- binder solution optimization, support material handling, materials specifications (MES)… Show more Utilized chemistry, polymers, and materials experience to increase yield, improve performance, and reduce cost of microelectronic products.• Developed high-throughput manufacturing processes for high-conductivity thermal interface (TIM) materials- tool specification, procurement, & qualification, and manufacturing process specifications (MPS).• Supported ceramic laminate manufacturing- binder solution optimization, support material handling, materials specifications (MES) adjustment, green sheets casting, conductive paste shelf-life extension, and ultrasonic mask cleaning.• Aided in the identification, screening, and implementation of temporary TIM solutions for microelectronic test and burn-in.• Performed competitive analysis of novel organic packaging solutions. Show less

Jul 2005 - Dec 2010

Postdoctoral Researcher (Joint Appointment)

Paris Area, France

• Critically reviewed experimental data and academic literature to develop new research projects and an improved understanding of the glassy dynamics of soft interpenetrable colloidal solutions.• Prepared new colloidal solutions and performed systematic rheological studies using a well defined research plan to illuminate the physics behind the ageing and shear melting of star glass solutions.• Rheological techniques included a combination of stress and strain controlled… Show more • Critically reviewed experimental data and academic literature to develop new research projects and an improved understanding of the glassy dynamics of soft interpenetrable colloidal solutions.• Prepared new colloidal solutions and performed systematic rheological studies using a well defined research plan to illuminate the physics behind the ageing and shear melting of star glass solutions.• Rheological techniques included a combination of stress and strain controlled experiments where samples were deformed in step, steady, and oscillatory conditions using techniques including large amplitude oscillatory shear (LAOS).• Co-authored eight peer reviewed publications which included aspects of this research. Show less

May 2008 - May 2009

Process Engineer

Waterford, Ny

• Improved manufacturing up-time and stability working within cross-disciplinary teams optimizing silicone coloring processes.• Increased revenue by adjusting the product menu and outsourcing select lines after identifying low revenue product lines.• Reduced tool changeover expenses between product lines by adjusting manufacturing scheduling and training to impacted shifts.

May 1999 - Dec 1999
Team & coworkers

Colleagues at IBM

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3 education records

Brian Erwin education

Doctor Of Philosophy (Ph.D.), Materials Science

Activities and Societies: Graduate Student Association, Materials Research Society, Habitat for Humanity Thesis Title: Temperature.

Master'S Degree, Chemical Engineering

Thesis Title: Performance Of An Indium Tin Oxide Strain Sensor Under High Temperature and High Frequency Conditions Thesis Advisor: Otto.

Bachelor'S Degree, Chemical Engineering With Polymer Engineering Option

Activities and Societies: AIChE Two years of undergraduate research experience working with Professor Ronald Danner at The Center.

FAQ

Frequently asked questions about Brian Erwin

Quick answers generated from the profile data available on this page.

What company does Brian Erwin work for?

Brian Erwin works for IBM.

What is Brian Erwin's role at IBM?

Brian Erwin is listed as Engineer, Packaging Failure Analysis and Diagnostics at IBM.

What is Brian Erwin's email address?

AeroLeads has found 2 work email signals at @ibm.com for Brian Erwin at IBM.

What is Brian Erwin's phone number?

AeroLeads has found 5 phone signal(s) with area code 845, 401, 814 for Brian Erwin at IBM.

Where is Brian Erwin based?

Brian Erwin is based in Millbrook, New York, United States while working with IBM.

What companies has Brian Erwin worked for?

Brian Erwin has worked for Ibm, Espci, Foundation For Research And Technology - Hellas (Forth) Institute Of Electronic Structure & Laser, and Ge Silicones.

Who are Brian Erwin's colleagues at IBM?

Brian Erwin's colleagues at IBM include Nisha Nadgauda, Merlin Ruben, Juana Casilimas, David De Lange, and Jean Louis Collet.

How can I contact Brian Erwin?

You can use AeroLeads to view verified contact signals for Brian Erwin at IBM, including work email, phone, and LinkedIn data when available.

What schools did Brian Erwin attend?

Brian Erwin holds Doctor Of Philosophy (Ph.D.), Materials Science from Penn State University.

What skills is Brian Erwin known for?

Brian Erwin is listed with skills including Materials Science, Thin Films, Semiconductors, Design Of Experiments, Process Engineering, Nanotechnology, Physics, and Characterization.

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